Curable Composition Molecular Weight Distribution for Film Quality
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Solution Overview
Problem
Epoxy-containing polyorganosilsesquioxanes with specific configurations exhibit excellent heat resistance and cracking resistance but suffer from poor film-formability, leading to crawling and pitting on substrate surfaces.
Innovation Solution
A curable composition comprising polyorganosilsesquioxanes with controlled molecular weights, specifically a combination of polyorganosilsesquioxanes with weight-average molecular weights of 3000 or more and 2500 or less, in specific proportions, to enhance film-formability and achieve heat resistance and cracking resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy-containing polyorganosilsesquioxanes with specific configuration are used, then heat resistance and cracking resistance are improved, but film-formability deteriorates causing crawling and pitting
Solution Approach 1:
The patent changes the molecular weight parameter of the polyorganosilsesquioxane from a single value to a distribution range (weight-average molecular weight of 2000 to 5000). This parameter change allows the material to maintain excellent heat resistance and cracking resistance while improving film-formability and preventing crawling and pitting defects on substrate surfaces.
Solution Approach 2:
The patent creates a composite molecular weight distribution system within the polyorganosilsesquioxane, combining lower molecular weight components (providing good film-formability) and higher molecular weight components (providing heat resistance and cracking resistance). This composite approach resolves the contradiction between reliability and manufacturing precision.
2Strength
If thermosetting adhesives containing BCB are used, then adhesiveness is improved, but curing temperature must be increased to high temperatures
Solution Approach 1:
The patent changes the chemical composition parameter by using epoxy-containing polyorganosilsesquioxane instead of BCB, which enables curing at lower temperatures (200-250°C) while maintaining excellent adhesiveness. This parameter change resolves the contradiction between strength and temperature requirements.
3Temperature
If thermosetting adhesives containing novolac epoxy resins are used, then high-temperature processing capability is improved, but adhesion deteriorates due to decomposition and outgassing
Solution Approach 1:
The patent changes the chemical composition parameter by replacing novolac epoxy resins with epoxy-containing polyorganosilsesquioxane, which has superior thermal stability and does not decompose or outgas at high temperatures. This maintains both high-temperature processing capability and adhesion reliability.
Solution Approach 2:
The patent selects a material (epoxy-containing polyorganosilsesquioxane) that is inherently stable at high temperatures and does not require protective measures against decomposition, effectively replacing materials that are 'short-lived' or unstable under high-temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition provides a cured product with excellent film-formability, heat resistance, and adhesiveness, preventing crawling and ensuring a smooth surface, while maintaining high reliability in bonding layers for electronic devices.
Implementation Method 1
a curable composition containing polyorganosilsesquioxanes (A)... can be cured at a low temperature to give a cured product having heat resistance, cracking resistance
Implementation Method 2
the curable composition has excellent film-formability and can give a cured product having... adhesiveness... at excellent levels... preventing crawling and ensuring a smooth surface
Data Source
AI summary
Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.