Curable Composition for Nanoimprint Pattern Collapse Prevention

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Solution Overview

Problem

In the photo-nanoimprint technique, incomplete curing due to low exposure doses leads to pattern collapse defects during the demolding step, resulting in low yield and defective products.

Innovation Solution

A curable composition that satisfies the formula Er1/Er2 ≥ 1.10 in a cured state, where Er1 is the surface reduced modulus and Er2 is the internal reduced modulus, is used to form a cured product with a sufficiently cured surface, reducing the likelihood of pattern collapse defects even at low exposure doses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the exposure dose is reduced to improve throughput, then the curing speed increases, but the curing completeness deteriorates leading to pattern collapse

Engineering Contradiction:
ImprovethroughputVSAvoidcuring completeness
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent changes the chemical composition parameters of the curable composition by incorporating specific polymerizable compounds with different reactivities and molecular weights, along with optimized photopolymerization initiator systems, to achieve sufficient curing at reduced exposure doses while maintaining high throughput

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite curable compositions combining multiple polymerizable compounds (acrylates, methacrylates, vinyl compounds) and multiple photopolymerization initiators to create a synergistic system that cures effectively at low exposure doses, resolving the contradiction between speed and completeness

Inventive Principle:
Principle #40Composite materials

2Loss of time

If the exposure dose is reduced to improve throughput, then the processing time decreases, but the pattern quality deteriorates due to pattern collapse

Engineering Contradiction:
Improveexposure timeVSAvoidpattern quality
Core Design Contradiction:
Loss of timeVSManufacturing precision

Solution Approach 1:

The patent optimizes molecular weight parameters and functional group concentrations of polymerizable compounds to achieve rapid gelation and network formation at low exposure doses, preventing pattern collapse while minimizing exposure time

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The curable composition is pre-formulated with optimized ratios of monomers and initiators that enable immediate and complete polymerization upon light exposure, ensuring pattern integrity is maintained even with brief exposure times

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The curable composition effectively prevents pattern collapse defects and ensures high yield by maintaining a sufficient cure quality at low exposure doses, suitable for manufacturing optical, circuit, and electronic components.

Implementation Method 1

The resist is then cured by photoirradiation (photoirradiation step)

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS10604609B2Curable composition and cured product thereof, method for producing cured product, method for manufacturing optical component, method for manufacturing circuit board, and method for manufacturing electronic component
Publication Date: 2020.03.31 CANON KK
  • US10604609B2 patent drawing
  • US10604609B2 patent drawing
  • US10604609B2 patent drawing

AI summary

To provide a curable composition for nanoimprinting that can form a cured product that has a sufficiently cured surface and is less prone to a pattern collapse defect even when the curable composition is cured by a photo-nanoimprint method at a low exposure dose. To provide a nanoimprint method for forming such a cured product. To provide a cured product that is less prone to a pattern collapse defect even when cured at a low exposure dose, a method for producing such a cured product, a method for manufacturing an optical component, a method for manufacturing a circuit board, and a method for manufacturing an electronic component.A curable composition that satisfies the formula (1) in a cured state:Er1/Er2≥1.10  (1)wherein Er1 denotes the surface reduced modulus (GPa) of a cured product of the curable composition, and Er2 denotes the internal reduced modulus (GPa) of the cured product.