Curable Composition for Bubble-Free Pattern Film Formation
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Solution Overview
Problem
Conventional pattern forming methods face issues with mold breakage due to trapped bubbles and require thick residual films, which hinder accurate pattern transfer and reduce productivity.
Innovation Solution
A curable composition with specific viscosity and solvent content, containing polymerizable compounds with aromatic or aromatic heterocyclic structures, allowing for rapid formation of a continuous liquid film without bubble entrapment and enabling efficient pattern transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a curable composition is used with conventional viscosity and solvent content, then the composition can be supplied onto the substrate, but bubbles become entrapped between the mold, substrate, and composition, causing mold breakage and reducing productivity
Solution Approach 1:
The patent applies parameter changes by precisely controlling the viscosity of the curable composition within 1-100 cP at 23°C and solvent content within 10-90 vol%. These parameter optimizations enable the composition to form a continuous liquid film rapidly without trapping bubbles, thereby preventing mold breakage while maintaining short filling times for high productivity
Solution Approach 2:
The patent applies preliminary action by ensuring the curable composition is pre-formulated with optimal viscosity and solvent content before supply. This preliminary optimization of composition properties enables the droplets to spontaneously form a continuous liquid film upon contact, preventing bubble entrapment before the molding process begins
2Reliability
If the residual film thickness is increased to prevent mold breakage, then mold breakage is reduced, but accurate pattern transfer becomes difficult
Solution Approach 1:
The patent resolves this contradiction through parameter changes by optimizing the viscosity of the curable composition to 1-100 cP at 23°C. This viscosity range enables the composition to form a sufficiently thick residual film for mold protection while maintaining the fluidity needed for accurate pattern transfer, eliminating the need to trade off between film thickness and pattern accuracy
3Ease of manufacture
If droplets of curable composition are discretely dropped onto the substrate, then the composition can be supplied in a controlled manner, but the droplets take time to spread and form a continuous film, reducing productivity
Solution Approach 1:
The patent applies parameter changes by controlling the viscosity of the curable composition within 1-100 cP at 23°C and solvent content within 10-90 vol%. These parameters are optimized to enable rapid spreading of discretely dropped droplets into a continuous liquid film, significantly reducing film formation time while maintaining controlled composition supply
Solution Approach 2:
The patent applies preliminary action by pre-formulating the curable composition with optimal viscosity and solvent content before the droplet dispensing step. This preliminary optimization ensures that once droplets are deposited, they spontaneously and rapidly spread to form a continuous film without requiring additional processing time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition facilitates rapid film formation, reduces mold breakage, and enhances productivity by ensuring accurate pattern transfer and improved filling properties.
Implementation Method 1
the curable composition is irradiated with light to cure the curable composition
Implementation Method 2
by the capillary phenomenon, the curable composition fills concave portions that form the pattern of the mold
Data Source
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AI summary
A curable composition contains a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (d), wherein the curable composition has a viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23°C, the curable composition in a state in which the solvent (d) is removed has a viscosity of not less than 30 mPa·s and not more than 10,000 mPa·s at 23°C, content of the solvent (d) to the whole curable composition is not less than 5 vol% and not more than 95 vol%, and the polymerizable compound (a) contains at least a compound (a-1) having a plurality of cyclic structures, in which at least one of the cyclic structures is an aromatic structure or an aromatic heterocyclic structure.