Curable Composition for High-Temperature Electronic Devices
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Solution Overview
Problem
Engineering plastics like polyimide and polyether ether ketone (PEEK) are difficult to melt and dissolve in solvents, making it challenging to produce molded bodies with excellent heat resistance and workability.
Innovation Solution
A curable composition containing a compound represented by Formula (1), which includes a divalent group with repeating units from benzophenone and other aromatic structures, dissolved in solvents such as ketones or amides, allowing for the formation of a cured product with excellent heat resistance, flame retardance, and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyimide or PEEK is used to achieve excellent heat resistance, then heat resistance is improved, but workability deteriorates because the materials hardly dissolve in solvents and do not easily melt
Solution Approach 1:
The patent modifies the chemical structure of polyimide by introducing a specific divalent group containing benzophenone and other aromatic structures (Formula I and II), which changes the physical parameters of the material. This structural modification enables the polyimide to dissolve in conventional solvents and melt at achievable temperatures while maintaining heat resistance, thus resolving the contradiction between heat resistance and workability
Solution Approach 2:
The invention creates a composite curable composition containing the modified polyimide compound (Formula 1), solvent, and curing catalyst. This composite formulation combines materials with complementary properties: the modified polyimide provides heat resistance, the solvent enables processing and dissolution, and the curing catalyst facilitates crosslinking. The composite achieves both excellent heat resistance and improved workability that neither component could achieve alone
2Temperature
If PEEK is used to achieve excellent heat resistance up to 260°C, then heat resistance is improved, but workability deteriorates because the melting point is 343°C making it difficult to melt and process
Solution Approach 1:
The patent introduces a divalent group with specific aromatic structures (benzophenone, hydroquinone, resorcinol, etc.) into the polyimide backbone, which modifies the thermal and rheological parameters of the material. This allows the material to maintain heat resistance comparable to PEEK while achieving lower processing temperatures and improved melt flow, thereby resolving the contradiction between heat resistance and workability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition enables the rapid curing of molded bodies with high crosslink density, achieving heat resistance up to 500°C and good dielectric properties, suitable for applications in electronic devices and other high-temperature environments.
Implementation Method 1
a curable composition including a compound represented by Formula (1) below and a solvent... the cured product of the compound represented by Formula (1) below has excellent heat resistance
Implementation Method 2
the compound represented by Formula (1) below has excellent workability because it has good solvent solubility
Data Source
AI summary
Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R1 and R2 each represent a curable functional group, and D1 and D2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar1 to Ar3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO2—, and Y represents —S—, —SO2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.