Curable Composition for UV Imprint Resist with High Etching Resistance
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Solution Overview
Problem
The UV imprint method faces challenges in achieving high dry etching resistance and precise pattern transfer due to the difficulty in removing resist residues from quartz molds, especially when using silicon-containing resins, which can lead to clogged molds and reduced precision in nanoimprint processes.
Innovation Solution
A curable composition containing a multifunctional polymerizable monomer with a specified silicon-containing group, allowing for high dry etching resistance and easy washing after curing, is developed, comprising a monomer with two or more polymerizable groups and 10 wt% or more silicon atoms, along with optional monofunctional or multifunctional polymerizable monomers, to enhance washability and pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a silicon-containing resist is used to achieve high dry etching resistance, then etching resistance is improved, but mold residues cannot be removed by plasma ashing treatment
Solution Approach 1:
The patent uses a composite resist system comprising a silicon-containing polymer component (for etching resistance) and a solubilizable resin component (for mold cleaning). This composite approach allows the resist to simultaneously achieve high dry etching resistance through the silicon-containing polymer while maintaining ease of mold cleaning through the solubilizable resin that can be removed by acid treatment or other cleaning methods.
2Ease of operation
If a resin with low curable functional group concentration is used to achieve easy washing, then washability is improved, but pattern transfer precision decreases
Solution Approach 1:
The patent optimizes the concentration of curable functional groups within a specific range (5-50 wt% of the total resist composition) to balance washability and pattern transfer precision. Additionally, the patent uses a multifunctional monomer with multiple polymerizable groups per molecule, which increases the effective functional group density without increasing the overall concentration, thereby maintaining both ease of washing and manufacturing precision.
3Reliability
If a multifunctional monomer with multiple polymerizable groups is used to improve curability, then crosslinking density increases, but viscosity increases making coating difficult
Solution Approach 1:
The patent introduces a multifunctional monomer at a controlled concentration (1-20 wt% of total monomer content) to provide localized crosslinking enhancement in critical areas without uniformly increasing viscosity throughout the entire resist composition. This allows high curability where needed while maintaining overall coating processability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides high dry etching resistance and excellent precision in fine pattern transfer, enabling effective removal of resist residues and maintaining mold cleanliness, thus improving the UV imprint process's efficiency and precision.
Implementation Method 1
a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group
Implementation Method 2
when a resist resin is a silicon-containing resist, SiO2 is produced by plasma treatment
Data Source
AI summary
A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.