Curable Composition for Low Shrinkage and Elastic Modulus
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Solution Overview
Problem
Current resin materials for semiconductor encapsulating fail to meet the requirements of low elastic modulus at high temperatures and low curing shrinkage percentage, leading to reliability issues due to warpage in thinner semiconductor components.
Innovation Solution
A curable composition comprising an esterification product of a phenolic compound and an aromatic polycarboxylic acid or acid halide, combined with a curing agent, which forms a cured product with low elastic modulus and shrinkage percentage under high temperature conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an active ester resin is used to achieve low elastic modulus at high temperature, then the cross-linking density is reduced, but the curing shrinkage percentage increases and melt viscosity becomes too high for semiconductor encapsulating applications
Solution Approach 1:
The invention changes the chemical structure parameters of the resin by using specific phenolic compounds (a1) with controlled hydroxyl group positions and aromatic polycarboxylic acids (a2) with specific carbon numbers in alkyl substituents. This structural parameter optimization enables simultaneous achievement of low elastic modulus (6.0-15.0 MPa at 260°C) and low curing shrinkage (0.6-0.9%), while maintaining acceptable melt viscosity for semiconductor encapsulating applications
Solution Approach 2:
The invention creates a composite resin system by combining specific phenolic compounds (a1) with aromatic polycarboxylic acids (a2) in controlled molar ratios (0.8:1.2 to 1.2:0.8). This composite approach allows the resin to exhibit both low elastic modulus and low curing shrinkage properties that cannot be achieved with single-component systems, making it suitable for thin semiconductor encapsulating applications
2Volume of moving object
If the thickness of semiconductor components is reduced, then miniaturization is achieved, but warpage and reliability degradation increase due to curing shrinkage
Solution Approach 1:
By optimizing the molecular structure parameters of the phenolic compound (a1) and aromatic polycarboxylic acid (a2), the invention achieves low curing shrinkage (0.6-0.9%) that prevents warpage in thin semiconductor components while maintaining the miniaturization benefits of reduced thickness
3Ease of manufacture
If conventional curing agents like phenol novolac resin are used, then processing is straightforward, but the elastic modulus at high temperature is too high for improved reflow properties
Solution Approach 1:
The invention modifies the chemical parameters of the curing system by using specific phenolic compounds (a1) and aromatic polycarboxylic acids (a2) that react to form a cured product with dramatically reduced elastic modulus (6.0-15.0 MPa at 260°C) compared to conventional phenol novolac resins, while maintaining ease of manufacturing through standard curing processes
Solution Approach 2:
The invention achieves local optimization of material properties by controlling the molecular structure at the molecular level (specific hydroxyl group positions and alkyl chain lengths) to create a cured product with uniformly low elastic modulus throughout, enabling improved reflow properties while maintaining processing ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces curing shrinkage and elastic modulus, enhancing the reliability of semiconductor encapsulating materials and printed wiring boards by improving thermal stability and reflow properties.
Implementation Method 1
an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2)
Data Source
AI summary
Provided are a curable composition capable of both exhibiting a low shrinkage percentage during curing and forming a cured product having a low elastic modulus under high temperature conditions, a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition. The curable composition includes an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and a curing agent. Also provided are a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition.