Curable Compound with Low Tg and High Aromatic Content
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Solution Overview
Problem
Engineering plastics like polyimides and PEEK have high melting temperatures and low solvent solubility, making them difficult to process and use in applications requiring good workability and heat resistance.
Innovation Solution
A curable compound with a number average molecular weight of 1000 to 15000, containing 50 wt.% or greater aromatic ring structure, good solvent solubility, and a glass transition temperature of 280°C or lower, which can be represented by Formula (1), allowing for easy processing and forming of a cured product with excellent heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If engineering plastics like polyimides and PEEK are used to achieve high heat resistance and strength, then heat resistance and mechanical properties are improved, but melting temperature increases and solvent solubility decreases, making workability poor
Solution Approach 1:
The patent changes the molecular weight parameter to a specific range (1000-15000) and controls the glass transition temperature parameter to 280°C or lower, which fundamentally alters the thermal and processing characteristics of the polymer, enabling both heat resistance and workability
Solution Approach 2:
The patent creates a composite structure by combining the curable compound with aromatic ring structures (50 wt.% or greater) and specific functional groups, achieving a material that integrates both processability and thermal stability properties
2Reliability
If high melting temperature materials are used to achieve high heat resistance, then heat resistance is improved, but processing difficulty increases due to high melting point
Solution Approach 1:
The patent deliberately sets the glass transition temperature parameter to 280°C or lower and controls molecular weight to 1000-15000, which lowers the melting point and enables easy processing while maintaining heat resistance through proper curing
3Reliability
If low solvent solubility materials are used to achieve high heat resistance, then heat resistance is improved, but workability deteriorates due to poor solubility
Solution Approach 1:
The patent controls the molecular weight parameter within 1000-15000 and incorporates aromatic ring structures at 50 wt.% or greater, which fundamentally improves solvent solubility to 1 g/100 g or more while maintaining heat resistance through proper curing
Solution Approach 2:
The patent creates a composite molecular structure combining curable functional groups with aromatic rings and specific linkages, achieving both good solvent solubility and high heat resistance in the final cured product
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable compound exhibits good solvent solubility, low melting temperature, and rapid curing, enabling the formation of a cured product with high heat resistance and dielectric properties, suitable for use in electronic devices and other applications.
Implementation Method 1
a curable compound including the following characteristics (a) to (e)... being capable of forming a cured product having excellent heat resistance
Data Source
AI summary
Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (Td5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.