Curable Conductive Grid EMI Shield for Thin Devices
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Solution Overview
Problem
Existing EMI shielding methods for integrated circuit devices often add weight and bulk, and require extensive use of conductive materials, making them inefficient for selective frequency blocking and adding bulk to electronic devices.
Innovation Solution
A curable electrically conductive material is applied in a grid or net pattern directly onto the nonconductive surface of electronic components, allowing for selective shielding by forming an open pattern of electrically conductive traces or lines, which can be coupled to underlying contacts for effective EMI protection without fully covering the component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a box-shaped shield made of sheet metal or metal screen is installed over the component, then EMI protection is provided, but weight and bulk are added to the device
Solution Approach 1:
The patent applies a thin film conductive coating directly onto the circuit board surface instead of using bulky box-shaped metal shields. This thin film approach provides EMI protection while minimizing weight and volume addition to the device.
Solution Approach 2:
The patent extracts only the essential EMI shielding function from the traditional box shield, implementing it as a selective conductive pattern on the circuit board rather than enclosing the entire component, thereby reducing material usage and weight.
2Object-affected harmful factors
If sheet metal or metal screen is used to construct the shield, then EMI protection is achieved, but the device becomes bulkier in thickness, length and width
Solution Approach 1:
The patent replaces thick metal shields with a thin film conductive coating applied directly to the circuit board, dramatically reducing the volume occupied by the EMI shielding structure while maintaining protective functionality.
Solution Approach 2:
The patent transitions from three-dimensional box shields to a two-dimensional planar conductive pattern on the circuit board surface, eliminating the need for vertical enclosure and reducing overall device volume.
3Object-affected harmful factors
If layers of conductive material are applied fully over a broad area and then removed in part, then EMI shielding is provided, but extensive material is required and the process is complex
Solution Approach 1:
The patent segments the conductive shielding material into specific functional patterns (such as ground planes or shield regions) directly on the circuit board, allowing precise material placement only where EMI protection is needed rather than applying material broadly and removing it.
Solution Approach 2:
The patent implements different conductive patterns in different regions of the circuit board according to local EMI requirements, providing shielding only where necessary and reducing overall conductive material consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces material usage, allows for selective frequency blocking, and maintains device thinness by applying the shield directly to the component, enhancing EMI protection while minimizing weight and bulk addition.
Implementation Method 1
The curable electrically conductive material is applied to the component surface in a flowable form and thereafter is cured or allowed to cure to form the electrically conductive shield
Implementation Method 2
an EMI shield may serve one or both of two purposes: it may be installed over a particular component to shield that component from effects of radiation from sources external to the component; and it may be installed over a particular component to prevent radiation originating in the particular component from affecting surrounding components or devices
Data Source
AI summary
An EMI shield can be formed directly on a component, e.g., an unpackaged or packaged semiconductor die, by depositing and curing a curable composition which includes electrically conductive particles and a carrier. In examples, the shield can be configured as a grid or net of electrically conductive traces or lines. The curable electrically conductive material may be applied to the component surface in a flowable form and cured or allowed to cure to form the electrically conductive shield. The shield can be electrically coupled to contacts on an underlying circuit panel or support. The coupling material may be a conductive adhesive, and may be or may include a material the same as, or similar to, the shield material.