Curable Copolymer Composition for Low-Loss Copper-Clad Insulation
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Solution Overview
Problem
Existing insulating materials face challenges in achieving low dielectric properties, high mechanical strength, and moldability, particularly for high-frequency applications, due to issues with heat resistance, adhesion to copper foils, and complex production processes.
Innovation Solution
A curable composition comprising an olefin-aromatic vinyl compound-aromatic polyene copolymer with specific molecular weight and monomer content ranges, along with additives, allows for easy molding and curing to produce a thermoplastic resin with excellent low dielectric properties and high mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polyolefins or aromatic vinyl compound polymers are used for low dielectric properties, then low dielectric constant and low dielectric tangent are achieved, but heat resistance is insufficient
Solution Approach 1:
The patent uses graft copolymers combining polyethylene or polypropylene with styrene-based polymer segments to create a composite material that maintains low dielectric properties while improving heat resistance through the aromatic vinyl compound segments
2Temperature
If fluorine-based resins are used for low dielectric properties and heat resistance, then excellent low dielectric constant and heat resistance are achieved, but device suitability is low due to difficulty in moldability and film formability
Solution Approach 1:
The patent modifies the molecular weight and composition parameters of the copolymer to achieve an optimal balance between heat resistance and moldability, allowing the material to be processed into films and devices while maintaining high temperature stability
3Temperature
If post-curable resins are used for heat resistance and easy handling, then heat resistance and ease of operation are improved, but dielectric constant and dielectric loss are relatively high
Solution Approach 1:
The patent introduces specific functional groups and polymer segments at localized regions within the copolymer structure to provide crosslinking capability and improve dielectric properties without compromising overall heat resistance
4Ease of manufacture
If general graft polymerization is used to produce olefin-based and styrene-based copolymer, then production is simplified, but graft efficiency is poor and polymer uniformity is insufficient
Solution Approach 1:
The patent uses specific catalysts and chain transfer agents as intermediaries to control the graft polymerization process, ensuring uniform distribution of styrene segments along the polyolefin chain while maintaining production efficiency
5Temperature
If cured product with crosslinked structure is produced for mechanical strength, then heat resistance is improved, but filling with large amount of filler becomes difficult
Solution Approach 1:
The patent performs preliminary blending and dispersion of fillers in the uncured copolymer matrix before curing, ensuring uniform distribution and preventing agglomeration that would otherwise occur with high filler loads in crosslinked systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cured product exhibits low dielectric constant and tangent, high elastic modulus, and strong adhesion to copper foils, suitable for high-frequency applications with improved processability and stability.
Implementation Method 1
an olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer... a curable composition comprising the olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer
Data Source
AI summary
Provided is an olefin-aromatic vinyl compoundaromatic polyene copolymerized oligomer satisfying the following conditions (1) to (4): (1) a number average molecular weight of the oligomer is 500 or more and less than 5000; (2) the aromatic vinyl compound monomer is an aromatic vinyl compound having 8 or more and 20 or less carbon atoms, and a content of the aromatic vinyl compound monomer unit is 0 mass% or more and 70 mass% or less; (3) the aromatic polyene monomer is one or more selected from polyenes having 5 or more and 20 or less carbon atoms and having a plurality of vinyl groups and/or vinylene groups in the molecule, and a content of the vinyl groups and/or the vinylene groups derived from the aromatic polyene is 1.5 pieces or more and less than 20 pieces per number average molecular weight; and (4) the olefin monomer is one or more selected from olefins having 2 or more and 20 or less carbon atoms, and a total of units of the olefin monomer, the aromatic vinyl compound monomer, and the aromatic polyene monomer is 100 mass%.