Curable Granular Silicone Composition for Semiconductor Sealing
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Solution Overview
Problem
Current curable silicone compositions face challenges in achieving hot-melt properties, excellent handleability, and high-temperature coloring resistance without requiring heating or solvent removal processes, particularly in the production of semiconductor devices where fast curability and mechanical strength are essential.
Innovation Solution
A curable granular silicone composition comprising organopolysiloxane resin fine particles with curing-reactive functional groups, a liquid organopolysiloxane with multiple curing-reactive groups, a hardener, and functional fillers, which can be mixed at room temperature to form a composition with hot-melt properties and excellent curing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If phenyl silicone resin is used to achieve hot-melt properties and mechanical strength, then excellent hot-melt properties and hardness are improved, but coloring resistance at high temperatures deteriorates
Solution Approach 1:
The invention uses a composite system combining methyl silicone resin (for heat resistance and coloring resistance) with phenyl silicone resin particles (for hot-melt properties and mechanical strength). This composite approach allows the material to exhibit both the thermal stability of methyl silicone and the hot-melt characteristics of phenyl silicone without the drawbacks of either component alone.
Solution Approach 2:
The invention creates local quality differentiation by using methyl silicone resin as the continuous phase (matrix) that provides overall heat resistance and coloring resistance, while dispersing phenyl silicone resin particles throughout to provide localized hot-melt properties and mechanical reinforcement. Each component performs its specialized function in its optimal environment.
2Stability of the object's composition
If organic solvent is used in kneading to achieve homogeneous mixing, then mixing homogeneity is improved, but production complexity increases due to solvent removal requirements
Solution Approach 1:
The invention extracts and eliminates the organic solvent from the kneading process entirely. Instead of using solvent-based mixing followed by solvent removal, the patent achieves homogeneous mixing through direct mechanical kneading of the silicone resin components, phenyl silicone particles, and fillers, thereby removing the complex solvent removal step from the production process.
Solution Approach 2:
The material components themselves serve as the mixing medium. The methyl silicone resin acts as a self-contained carrier that allows direct mixing of all ingredients without requiring external solvents. The components mix and bond through their inherent properties, making the system self-sufficient and eliminating the need for additional solvent management steps.
3Loss of substance
If high temperature heating is applied for solvent removal, then solvent elimination is achieved, but curability control deteriorates and production time increases
Solution Approach 1:
The invention converts the previously harmful effect of requiring high-temperature heating (which caused curability control issues and time loss) into a benefit by eliminating the need for such heating entirely. The organic solvent-free formulation allows processing at lower temperatures where curability can be properly controlled, turning the limitation into an advantage for process control.
Solution Approach 2:
The invention changes the temperature parameter from high-temperature processing (required for solvent removal) to low-temperature processing (suitable for curability control). This parameter change fundamentally alters the processing conditions, enabling precise control of curability while reducing production time and eliminating solvent removal requirements.
4Strength
If phenyl silicone resin composition is used for semiconductor device sealing, then mechanical strength is improved, but light reflectance decreases due to coloring
Solution Approach 1:
The invention creates a composite sealing material where methyl silicone resin provides the continuous matrix with excellent light reflectance and coloring resistance, while phenyl silicone resin particles dispersed within provide mechanical strength reinforcement. This composite structure allows the sealant to maintain both optical properties and mechanical performance for semiconductor device applications.
Solution Approach 2:
The invention applies local quality by concentrating the light-reflective methyl silicone resin in the continuous phase to ensure overall optical performance, while placing phenyl silicone particles strategically as dispersed reinforcement to provide localized mechanical strength where needed, without compromising the optical properties of the bulk material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables efficient production of semiconductor device members with excellent mechanical strength and high-temperature coloring resistance, suitable for use in semiconductor devices and optical components, while simplifying the production process by eliminating the need for heating or solvent removal.
Implementation Method 1
comprising an organohydrogenpolysiloxane (A) and organopolysiloxane resin fine particles (B) which have not undergone crosslinking reaction yet
Implementation Method 2
having at least two silicon bonded hydrogen atoms in the molecule
Implementation Method 3
heating and melting the composition to 100° C. or higher
Data Source
AI summary
Provided is a curable granular silicone composition which has hot-melt properties, is excellent in terms of handleability and curability in overmolding and the like, and gives cured objects and the like highly inhibited from taking a color at high temperatures. The curable granular silicone composition comprises: (A) organopolysiloxane resin fine particles which do not have hot-melt properties and have a curing-reactive functional group containing a carbon-carbon double bond and in which siloxane units represented by RSiO3/2 (where R is a monovalent organic group) or SiO4/2 account for at least 20 mol % of all the siloxane units; (B) a liquid, linear or branched organopolysiloxane having, in the molecule, at least two curing-reactive functional groups containing a carbon-carbon double bond; (C) a hardener; and (D) a functional filler. The composition as a whole has hot-melt properties. Uses of the curable granular silicone composition are also disclosed.