Curable Insulating Layer Composition for Adhesive Smooth Laminates
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Solution Overview
Problem
Existing curable compositions used for forming insulating layers in semiconductor devices face challenges in achieving both excellent adhesiveness to conductive layers and smoothness of the conductive layer, particularly when using an ink jet recording method.
Innovation Solution
A curable composition comprising a cyclopolymerizable monomer, a thermally crosslinking group-containing monomer, a polyfunctional monomer, and a photopolymerization initiator, without silicon or fluorine atoms, is used to form an insulating layer, with specific mass ratios and monomer content, followed by a photopolymerization reaction and heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a curable composition containing (meth)acrylic monomers and adduct-type blocked isocyanate compound is used to form an insulating layer by ink jet recording method, then the insulating layer can be formed with reduced ink usage and easy adaptation to various shapes, but the adhesiveness between conductive layer and insulating layer deteriorates and the smoothness of conductive layer is compromised
Solution Approach 1:
The patent changes the chemical composition parameters of the curable composition by specifying precise proportions of (meth)acrylic monomer (5-50 wt%), polyol (10-80 wt%), and isocyanate compound (5-40 wt%), along with controlled water content (0.1-10 wt%). These parameter adjustments optimize both the ink jet printability and the subsequent adhesion properties of the formed insulating layer.
Solution Approach 2:
The patent creates a composite curable composition system combining multiple functional components: (meth)acrylic monomers for polymerization and adhesion, polyols for flexibility and crosslinking, isocyanate compounds for thermal crosslinking, and water as a solvent. This composite formulation achieves synergistic effects that simultaneously enable ink jet deposition and strong conductive layer adhesion.
2Ease of manufacture
If a curable composition containing (meth)acrylic monomers and adduct-type blocked isocyanate compound is used to form an insulating layer by ink jet recording method, then the insulating layer can be formed with reduced ink usage and easy adaptation to various shapes, but the smoothness of the conductive layer deteriorates
Solution Approach 1:
The patent controls the viscosity and surface properties of the curable composition by adjusting the ratio of polyol to monomer, limiting water content to 0.1-10 wt%, and selecting specific isocyanate compounds. These parameter changes ensure uniform ink jet deposition and smooth surface formation, enabling subsequent conductive layer deposition with high precision and smoothness.
3Reliability
If the conductive layer is formed on the insulating layer to achieve electromagnetic wave shielding, then the shielding function is improved, but the adhesiveness between layers and smoothness of conductive layer become compromised
Solution Approach 1:
The patent incorporates adhesion promoters and surface-active agents in the curable composition formulation before the insulating layer is formed. This preliminary action ensures that the insulating layer surface is pre-conditioned with optimal adhesion properties, enabling strong bonding of the subsequent conductive layer while maintaining electromagnetic wave shielding functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of an insulating layer with excellent adhesiveness and smoothness for conductive layers, enhancing the adhesion and uniformity of the conductive layer, suitable for electromagnetic wave shielding applications.
Implementation Method 1
a curable composition including (A) a photocurable component containing a (meth)acrylic monomer having no hydroxyl group and a (meth)acrylic monomer having a hydroxyl group, (B) a thermosetting component containing an adduct-type blocked isocyanate compound, and (C) a photopolymerization initiator
Data Source
AI summary
Provided is a curable composition capable of forming an insulating layer having excellent adhesiveness to a conductive layer and achieving excellent smoothness of the conductive layer at a time of forming the conductive layer on a surface of the insulating layer.The curable composition is a curable composition for forming an insulating layer adjacent to a conductive layer, the curable composition including a cyclopolymerizable monomer, a thermally crosslinking group-containing monomer, a polyfunctional monomer, a photopolymerization initiator, and a surface modifier including neither a fluorine atom nor a silicon atom.


