Curable Linear Polymers for Stable Dielectric Layers
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Solution Overview
Problem
Current electronic devices using organic or amorphous semiconductors face challenges in achieving robust and stable dielectric layers with low leakage currents, air and moisture stability, and compatibility with diverse substrates and semiconductor materials, which are essential for flexible and cost-effective manufacturing.
Innovation Solution
Development of linear polymers that can be solution-processed into physically robust and ambient-stable thin films, suitable for use as dielectric or passivation layers in electronic devices, with properties such as low leakage current densities, high breakdown voltages, and compatibility with various semiconductor materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional dielectric materials are used in TFTs, then device fabrication can proceed, but the dielectric layers lack robustness, stability, and low leakage current properties
Solution Approach 1:
The patent modifies the chemical structure of polymer dielectric materials by incorporating specific functional groups and adjusting molecular weight to achieve optimal balance between stability and processability. The dielectric layers are formed through solution processing followed by controlled curing at specific temperatures to optimize both fabrication ease and device reliability
Solution Approach 2:
The invention uses composite polymer structures combining different functional segments - hydrophobic regions for moisture barrier properties, polar regions for dielectric performance, and crosslinkable groups for mechanical robustness. This composite approach enables simultaneous achievement of stability and manufacturability
2Ease of manufacture
If solution-phase deposition is used to process organic semiconductors, then manufacturing cost and flexibility improve, but compatible dielectric materials with appropriate surface properties are difficult to find
Solution Approach 1:
The patent develops universal polymer dielectric formulations that can be processed from common solvents and deposited on diverse substrates including plastic, glass, and metal. The dielectric layers are designed to work with both organic and inorganic semiconductors, providing a single platform solution for multiple applications
Solution Approach 2:
The polymer dielectric acts as an intermediary layer between the solution-processed semiconductor and the substrate or gate electrode. The dielectric surface is engineered with appropriate energy and roughness to enable good contact with solution-deposited semiconductor layers while maintaining electrical insulation
3Reliability
If the dielectric material is made more robust and stable, then device operation improves, but the material becomes less compatible with diverse substrates and semiconductor materials
Solution Approach 1:
The patent creates dielectric polymers with locally differentiated properties - hydrophobic segments for moisture resistance, polar segments for interfacial compatibility, and crosslinkable segments for mechanical robustness. Each local region of the polymer chain contributes differently to overall performance, enabling simultaneous achievement of stability and compatibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of electronic devices with improved stability, reduced leakage currents, and enhanced compatibility with different substrates and semiconductor materials, facilitating flexible and cost-effective manufacturing processes.
Implementation Method 1
the linear polymer can be deposited from a solution
Implementation Method 2
then curable into a physically robust and ambient-stable thin film
Data Source
AI summary
Disclosed are curable linear polymers that can be used as active and/or passive organic materials in various electronic, optical, and optoelectronic devices. In some embodiments, the device can include an organic semiconductor layer and a dielectric layer prepared from such curable linear polymers. In some embodiments, the device can include a passivation layer prepared from the linear polymers described herein. The present linear polymers can be solution-processed, then cured thermally (particularly, at relatively low temperatures) and/or photochemically into various thin film materials with desirable properties.