Curable Organopolysiloxane Composition for Adhesive Layers
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Solution Overview
Problem
Current solvent-free or low-solvent curable silicone pressure-sensitive adhesive compositions lack sufficient mechanical strength and adhesive strength for a wide range of applications, including electronic components and semiconductor devices, due to insufficient tackiness and bonding properties.
Innovation Solution
A curable organopolysiloxane composition comprising 30 to 99 parts of a chain organopolysiloxane with two or more alkenyl groups, 0.1 to 70 parts of an organopolysiloxane resin with a specific M to Q unit ratio, and 0.1 to 10 parts of a radical polymerization initiator, optionally including monofunctional or polyfunctional vinyl monomers and organopolysiloxane compounds with acrylic or methacrylic groups, allowing for low-solvent coating and radical polymerization curing using heat or high-energy beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solvent-free or low-solvent curable silicone pressure-sensitive adhesive compositions are used, then environmental compliance and coating simplicity are improved, but mechanical strength and adhesive strength become insufficient
Solution Approach 1:
The patent uses a composite composition comprising organopolysiloxane (main agent), vinyl monomer (crosslinking agent), and photoinitiator. This composite system enables UV-curable solvent-free adhesive with sufficient adhesive strength while maintaining coating simplicity, resolving the contradiction between ease of manufacture and adhesive strength.
Solution Approach 2:
The patent changes the curing mechanism from thermal to UV photopolymerization, and adjusts the composition parameters (organopolysiloxane with specific viscosity range, vinyl monomer content at 5-50 parts by mass) to achieve both solvent-free formulation and adequate adhesive strength. This parameter optimization resolves the contradiction between coating simplicity and adhesive performance.
2Quantity of substance
If UV-curable organopolysiloxane compositions with organopolysiloxanes having (meth)acrylic functional groups and photoinitiators are used, then solvent-free formulation is achieved, but the cured product becomes gel-like with insufficient mechanical strength and adhesive strength
Solution Approach 1:
The patent changes the functional groups from (meth)acrylic to vinyl groups, and adjusts the viscosity parameter of organopolysiloxane to 10-10,000 cP. This parameter change prevents gel-like cured product formation while maintaining solvent-free formulation, thereby improving mechanical strength.
Solution Approach 2:
The patent uses vinyl monomer as a crosslinking agent that provides adequate mechanical strength without requiring complex additives or high solvent content. This simple crosslinking system achieves solvent-free formulation with sufficient mechanical properties.
3Strength
If high temperature heat curing is used for curable silicone compositions, then adhesive strength and bonding properties are improved, but energy consumption increases and low temperature applications are limited
Solution Approach 1:
The patent replaces thermal curing mechanism with UV photopolymerization. The UV irradiation initiates radical polymerization of vinyl groups, achieving adequate bonding strength without high temperature heating, thus reducing energy consumption and enabling low temperature applications.
Solution Approach 2:
The patent utilizes the phase transition from liquid monomer to solid polymer network through UV-induced photopolymerization. This phase change occurs at room temperature or low temperatures, providing bonding strength without high temperature energy input.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves sufficient tackiness and adhesive strength, enabling the formation of an organopolysiloxane pressure-sensitive adhesive layer with excellent transparency and low turbidity, suitable for various industrial applications, including electronic materials and semiconductor components.
Implementation Method 1
a curable organopolysiloxane composition that can be solvent free or low solvent as necessary, and forms an organopolysiloxane pressure-sensitive adhesive layer by advancing a radical polymerization curing reaction using heat or a high energy beam
Data Source
AI summary
Provided is a curable organopolysiloxane composition that can be heat curable and photocurable, and that has sufficient tackiness, enabling design of a composition that can coat even when using a small amount of solvent, a cured product thereof, and use thereof. The curable organopolysiloxane composition comprises (A) a chain organopolysiloxane having an alkenyl group, (B) a specific MQ type organopolysiloxane resin, and (C) a radical polymerization initiator. As an optional component, the composition may further comprise (D) at least one type of radical reactive component selected from (D1) vinyl monomers, and (D2) (meth)acrylic group-containing organopolysiloxane compounds. The sum of component (A), component (B), and component (D2) with respect to the total solid mass of the composition is 50 mass % or higher.