Curable Organopolysiloxane Composition for Thermal Conductivity
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Solution Overview
Problem
Existing thermally conductive materials, such as sheets and greases, face limitations in thermal conductivity and workability, leading to inadequate heat radiation performance in electronic components due to limited filler content and potential contamination or leakage issues.
Innovation Solution
A curable organopolysiloxane composition is developed, incorporating low melting gallium or gallium alloys and thermally conductive fillers, which are uniformly dispersed in a resin matrix, forming a crosslinked network upon curing to create a thermally conductive layer that enhances heat radiation without contamination or leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the amount of thermally conductive filler is increased to improve thermal conductivity, then thermal conductivity is improved, but apparent viscosity increases excessively making workability and processability poor
Solution Approach 1:
The patent uses a composite material system combining low melting point metal particles (gallium, indium, or their alloys) with a curable silicone resin matrix. This composite approach allows the metal particles to provide thermal conductivity while the resin matrix controls viscosity and workability, resolving the contradiction between filler amount and operability
Solution Approach 2:
The patent changes the physical state parameter of the filler by using low melting point metals (melting point 150°C or lower) that are liquid at processing temperatures. This parameter change allows the filler to remain uniformly dispersed in the resin without excessive aggregation, maintaining both high thermal conductivity and good workability
2Reliability
If low melting point metals are used to improve thermal conductivity, then thermal conductivity is improved, but contamination of other parts and oily matter leakage occur over time
Solution Approach 1:
The curable silicone resin acts as an intermediary matrix that encapsulates the low melting point metal particles. This intermediary structure prevents direct contact between the metal filler and surrounding components, eliminating contamination while the metal particles continue to provide thermal conduction pathways
Solution Approach 2:
The cured silicone resin forms a flexible crosslinked network that surrounds and constrains the metal filler particles. This shell-like structure prevents oily matter leakage while accommodating thermal expansion, solving the contamination and leakage problems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides improved thermal conductivity and reliability by forming a stable, crosslinked network that effectively transmits heat from electronic components to radiating members, outperforming traditional materials in heat radiation performance and maintaining integrity over time.
Implementation Method 1
a material excellent in thermal conductivity is formulated in a necessary and sufficient amount and the material is uniformly dispersed in a resin matrix in particulate form
Implementation Method 2
forming a crosslinked network upon curing to create a thermally conductive layer
Data Source
AI summary
A curable organopolysiloxane composition in grease or paste form, which including:(A) an organopolysiloxane having at least two alkenyl groups bonded to silicon atom in one molecule;(B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicone atom in the molecule;(C) gallium and/or a gallium alloy having a melting point of 0 to 70° C.;(D) a thermally conductive filler having an average particle size of 0.1 to 100 μm;(E) a platinum-based catalyst; and(F) a polysiloxane of the following general formula (1):wherein R1 may be the same or different and represents a monovalent hydrocarbon group, R2 represents an alkyl group, an alkoxyl group, an alkenyl group or an acyl group, a is an integer of 5 to 100, and b is an integer of 1 to 3.