Curable Organopolysiloxane Composition for Semiconductor Devices
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Solution Overview
Problem
Curable organopolysiloxane compositions used in semiconductor devices often result in cured products with low optical transmittance, poor adherence to substrates, and ease of peeling, which compromises the reliability of semiconductor parts.
Innovation Solution
A curable organopolysiloxane composition comprising a branched-chain organopolysiloxane with multiple alkenyl groups, a linear-chain organopolysiloxane capped with diorganohydrogensiloxy groups, and a hydrosilylation catalyst, optimized to achieve high refractive index, high optical transmittance, and strong adhesion to substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional curable organopolysiloxane compositions are used, then the cured product achieves high transmittance and index of refraction, but the adherence to substrates deteriorates and peeling occurs easily
Solution Approach 1:
The patent modifies the chemical composition parameters by incorporating specific adhesion promoters (silane coupling agents) and controlling the ratio of crosslinking agents to base polymers. This changes the chemical structure and bonding characteristics of the cured product, enabling simultaneous achievement of high optical transmittance and strong substrate adherence without peeling
Solution Approach 2:
The patent creates a composite material system combining organopolysiloxane base polymers with adhesion promoters and crosslinking agents. This composite approach integrates the optical properties of polysiloxane with the adhesive properties of silane coupling agents, resolving the contradiction between transmittance and adherence
2Illumination intensity
If conventional curable organopolysiloxane compositions are used, then the cured product achieves high index of refraction, but the hardness deteriorates
Solution Approach 1:
The patent adjusts the crosslinking density and network structure parameters by selecting specific crosslinking agents and controlling their concentration. This optimization allows the cured product to maintain high index of refraction while achieving adequate hardness through improved molecular network architecture
3Ease of manufacture
If conventional curable organopolysiloxane compositions are used, then the composition achieves ease of curing by hydrosilylation reaction, but the cured product suffers from poor adherence and peeling
Solution Approach 1:
The patent incorporates adhesion promoters and coupling agents into the composition before curing. This preliminary incorporation ensures that adhesive functionality is already present in the matrix before the curing process occurs, allowing the cured product to maintain both ease of curing and strong substrate adherence
Solution Approach 2:
The patent uses silane coupling agents as intermediary substances that bridge the organic polysiloxane matrix and the inorganic substrate. These intermediaries provide chemical bonding sites on both sides, enabling strong adhesion while maintaining the ease of hydrosilylation curing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition produces a cured body with high refractive index, high optical transmittance, and excellent adhesion, enhancing the reliability of semiconductor devices by preventing peeling and ensuring durability.
Implementation Method 1
Curable organopolysiloxane compositions curable by a hydrosilylation reaction
Data Source
Figure 1
AI summary
A curable organopolysiloxane composition comprising: (A) a branched-chain organopolysiloxane that contains in one molecule at least three alkenyl groups and at least 30 mole % of all silicon-bonded organic groups in the form of aryl groups; (B) a linear-chain organopolysiloxane that contains aryl groups and has both molecular terminals capped with diorganohydrogensiloxy groups; (C) a branched-chain organopolysiloxane that contains in one molecule at least three diorganohydrogensiloxy groups and at least 15 mole % of all silicon-bonded organic groups in the form of aryl groups; and (D) a hydrosilylation catalyst. The composition is capable of forming a cured body that has a high index of refraction and strong adhesion to substrates.