Curable Organopolysiloxane Composition for Semiconductor Optical Devices
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Solution Overview
Problem
Existing curable organopolysiloxane compositions used for semiconductor devices have high viscosity and poor curability, leading to issues with fillability and adhesion to substrates, while also absorbing or dissipating light, which is undesirable for optical semiconductor elements.
Innovation Solution
A curable organopolysiloxane composition comprising specific organopolysiloxane components (A, B, C, and a hydrosilylation catalyst D) that improve curability and fillability, with a cured body exhibiting high refractive index, high light transmissivity, and strong adhesion to substrates, optimized for semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If existing curable organopolysiloxane compositions are used to achieve high refractive index and light transmissivity, then optical properties are improved, but viscosity increases and fillability deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters by introducing specific organopolysiloxane structures with controlled phenyl and alkenyl group contents, and by optimizing the ratio of crosslinking agent to base resin. This achieves high refractive index and light transmissivity while maintaining lower viscosity through molecular structure design rather than adding fillers that would increase viscosity.
2Illumination intensity
If existing curable organopolysiloxane compositions are used to achieve high refractive index, then optical properties are improved, but curing reaction temperature increases and curability deteriorates
Solution Approach 1:
The patent optimizes the chemical composition parameters including the ratio of crosslinking agent to base resin (0.5-2.0 moles per mole of alkenyl groups), and controls the phenyl group content (25-75 mole%) and alkenyl group content (0.5-20 mole%). These parameter changes enable the curing reaction to proceed at lower temperatures by improving the reactivity and crosslinking efficiency of the system.
Solution Approach 2:
The patent creates a composite system combining specific organopolysiloxane base resin with crosslinking agents and catalysts. This composite material system achieves synergistic effects where the crosslinking agents enhance curability and reduce curing temperature while the base resin maintains high refractive index and light transmissivity properties.
3Illumination intensity
If existing curable organopolysiloxane compositions are used to achieve high refractive index, then optical properties are improved, but adhesion to substrates deteriorates
Solution Approach 1:
The patent controls the chemical composition parameters including phenyl group content (25-75 mole%) and alkenyl group content (0.5-20 mole%), and optimizes the crosslinking agent ratio. These parameter changes create a balanced molecular structure that provides both high refractive index through phenyl groups and strong adhesion through controlled crosslinking density and functional group content.
Solution Approach 2:
The patent develops a composite material system where the combination of base resin, crosslinking agents, and catalysts creates a cured body with optimized network structure. This composite system achieves simultaneous improvement in optical properties and adhesion strength through synergistic interactions between components rather than relying on a single material property.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves good fillability and curability, with a cured body showing high refractive index, high light transmissivity, and strong adherence to substrates, enhancing the reliability of semiconductor devices.
Implementation Method 1
Curable organopolysiloxane compositions that can be cured by a hydrosilylation reaction
Data Source
AI summary
A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.