Curable Organosilicon Composition for LED Encapsulation
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Solution Overview
Problem
Conventional materials for LED encapsulation suffer from discoloration when exposed to ultraviolet light or heat, compromising their performance in terms of light resistance, heat resistance, and crack resistance.
Innovation Solution
A curable organosilicon composition comprising a polycyclic hydrocarbon group-containing organosilicon compound, a siloxane-based compound with alkenyl groups, and a hydrosilylation reaction catalyst, which forms a cured product with enhanced hardness, transparency, and crack resistance through a hydrosilylation reaction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional epoxy resins are used for LED encapsulation, then hardness and crack resistance are improved, but light resistance deteriorates due to discoloration under ultraviolet exposure
Solution Approach 1:
The patent uses a composite silicone resin system combining polyhedral oligosilsesquioxane (POSS) with silicone resin to create a material that achieves both mechanical strength and UV resistance. The POSS structure provides a rigid framework that enhances hardness and crack resistance while the silicone resin matrix maintains transparency and light resistance, resolving the contradiction between strength and light resistance.
2Temperature
If soft silicone resins are used for LED encapsulation, then heat resistance is improved, but workability deteriorates and the material is prone to dirt and dust adhesion
Solution Approach 1:
The patent modifies the silicone resin parameters by incorporating POSS structures and adjusting the resin composition ratio to achieve optimal balance. The POSS-containing resin provides enhanced heat resistance while the controlled molecular structure and crosslinking density maintain good workability and reduce surface adhesion properties, resolving the contradiction between heat resistance and ease of operation.
3Ease of operation
If hard silicones are used for LED encapsulation, then workability is improved, but crack resistance deteriorates
Solution Approach 1:
The patent creates a composite structure where POSS rigid units are distributed within a flexible silicone resin matrix. This composite architecture provides good workability from the silicone base while the POSS structures form a reinforcing network that significantly improves crack resistance, resolving the contradiction between ease of operation and crack resistance.
4Power
If LED output is increased for higher performance, then light emission capability is improved, but heat generation and ultraviolet emission increase, requiring better material resistance
Solution Approach 1:
The patent converts the harmful effects of increased UV and heat exposure into beneficial validation of the material's performance. The POSS-silicone composite is specifically designed to withstand and resist these harsh conditions, transforming the previously harmful high-power LED environment into a demonstration of the material's superior heat resistance and UV stability, thereby supporting higher power applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cured product exhibits high hardness, excellent transparency, and superior crack and heat resistance, making it suitable for protecting and encapsulating light-emitting diode elements and other electronic devices.
Implementation Method 1
a curable organosilicon composition comprising: (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of: (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule... (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule... and (C) a hydrosilylation reaction catalyst
Implementation Method 2
a curable organosilicon composition comprising: (A) a polycyclic hydrocarbon group-containing organosilicon compound... and is an addition reaction product of: (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms... and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds... (C) a hydrosilylation reaction catalyst
Data Source
AI summary
Provided is a curable organosilicon composition comprising (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule, and (C) a hydrosilylation reaction catalyst. The curable organosilicon composition yields a cured product that has a high degree of hardness and excellent transparency, crack resistance and heat resistance, and is useful as a curable silicone material, an encapsulating material for optical devices such as optical elements, an encapsulating material for other electronic devices such as semiconductor elements, and an electrically insulating coating material.