Curable Polymer Composition for Low Dk and Df Applications
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Solution Overview
Problem
Current curable polymer compositions for miniaturized electronic devices face challenges in controlling premature cross-linking, which affects their electrical properties such as dielectric constant (Dk) and dissipation factor (Df), and are difficult to process due to reactivity issues.
Innovation Solution
A curable polymer composition comprising a copolymer of diisoalkenylarene and divinylarene with an anti-scorching agent, selected from styrene derivatives and hindered phenolic compounds, that minimizes premature cross-linking and maintains low Dk and Df values, while allowing for high cure rates and improved mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anti-scorching agents are added to control reactivity and prevent premature cross-linking, then premature cross-linking is reduced, but Dk and Df values deteriorate
Solution Approach 1:
The patent changes the chemical structure parameters of the polymer by using diisoalkenylarene instead of conventional di vinyl monomers, and by controlling the molecular weight and composition of the copolymer. This parameter change allows the use of lower levels of anti-scorching agents (0.001-10 wt.%) while maintaining both reactivity control and electrical properties
Solution Approach 2:
The patent creates a composite polymer system by copolymerizing diisoalkenylarene with divinylarene in specific ratios (1:15 to 15:1). This composite structure combines the reactivity control benefits of diisoalkenylarene with the cross-linking capabilities of divinylarene, achieving both premature cross-linking prevention and good electrical properties
2Productivity
If highly reactive polymers are used to achieve high cure rates, then cure rate is improved, but premature cross-linking increases during shipping and storage
Solution Approach 1:
The patent incorporates anti-scorching agents in the polymer composition before shipping and storage, which preliminarily protect the reactive polymer groups from premature cross-linking. This preliminary protective action allows the polymer to maintain high reactivity for fast curing while remaining stable during storage and shipping
Solution Approach 2:
The patent creates a dynamic system where the anti-scorching agents are temporarily active during storage to prevent premature cross-linking, but become inactive or are consumed during the curing process, allowing the polymer to achieve high cure rates when needed. The system dynamically switches from protection mode to curing mode
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively delays premature cross-linking, enabling higher cure temperatures and maintaining low Dk and Df values, thus enhancing the electrical and mechanical properties of the polymer, suitable for use in compact electronic devices.
Implementation Method 1
Anti-scorching agents or radical scavengers are known in the art to control reactivity of polymers in compositions, particularly to avoid premature cross-linking
Implementation Method 2
The curable polymer composition at a concentration of 72.5 wt. % in toluene, after storing at 40° C. for 1 day, has a solution viscosity as measured by Brookfield Viscometer at 25° C. of at least 20% less than the solution viscosity of a polymer composition without the anti-scorching agent
Data Source
AI summary
The disclosure relates to a curable polymer composition comprising (i) a copolymer of a diisoalkenylarene (DIAEA) and a divinylarene (DVA), and (ii) at least one anti-scorching agent. The copolymer has a solubility in a hydrocarbon solvent at 25° C. for a period of less than 4 hours of at least 10 wt. %, a glass transition temperature (Tg) of 50 to 300° C., and a Gel Content of less than 5 wt. %. The curable polymer composition is cured at a temperature of greater than 140° C. to obtain a cured polymer composition having a Gel Content in a hydrocarbon solvent of >90%, and low Dk and Df values. The curable polymer composition does not cross-link or has minimal premature cross-linking in steps such as processing, storage, etc., and can be used in copper clad lamination applications.