Curable Polymer for Low Dielectric Loss Wiring Boards
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Solution Overview
Problem
Existing wiring boards used in high-frequency applications, such as portable electronic devices, face challenges in reducing dielectric loss and maintaining a high glass transition temperature, which are essential for reliable communication and thermal stability.
Innovation Solution
A curable polymer is developed, comprising structural units represented by a specific formula, which can be used to produce a resin with low dielectric dissipation factor and high glass transition temperature. This polymer is incorporated into a curable composition, prepreg, multilayer body, metal clad laminate, and wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyphenylene ether (modified PPE) oligomer is used as a curable polymer for prepreg, then the resin achieves good processability and adhesion, but the dielectric dissipation factor increases at high frequencies
Solution Approach 1:
The patent employs a composite resin system combining modified PPE oligomer with other curable compounds (epoxy resin, phenolic resin, or cyanate ester resin) to achieve both good adhesion/processability and low dielectric dissipation factor. The synergistic effect of multiple materials resolves the contradiction between reliability and energy loss.
Solution Approach 2:
The patent modifies the chemical structure parameters of the curable polymer by introducing specific structural units with particular functional groups that balance polarity for adhesion while minimizing dielectric loss. The molecular weight and composition ratios are optimized to achieve the desired property balance.
2Loss of energy
If the dielectric dissipation factor is reduced for high-frequency applications, then the transmission loss decreases, but the glass transition temperature may be compromised
Solution Approach 1:
The patent uses composite resin systems where different materials contribute different properties: modified PPE oligomer provides low dielectric dissipation factor while epoxy or phenolic resins contribute high glass transition temperature. This composite approach resolves the contradiction between energy loss and temperature resistance.
Solution Approach 2:
The patent introduces specific structural units with localized functional characteristics into the polymer chain. These units are distributed to provide low dielectric loss in the bulk while maintaining crosslinking density for high glass transition temperature, achieving local property optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable polymer effectively reduces the dielectric dissipation factor under high-frequency conditions and maintains a sufficiently high glass transition temperature, enhancing the performance and reliability of wiring boards in high-frequency applications.
Implementation Method 1
a curable polymer containing one or more type(s) of structural units (UX) represented by the following formula... which is for production of a prepreg, a metal clad laminate or a wiring board
Data Source
AI summary
A curable polymer containing one or more type(s) of structural units (UX) represented by the following formula and which is for production of a prepreg, a metal clad laminate or a wiring board:in which X is a single bond or an oxygen atom; the benzene ring optionally has a substituent other than the substituent in the above formula; and n is an integer of 0 or more.