Curable Polysiloxane Composition for LED Encapsulation
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Solution Overview
Problem
Current encapsulation materials for LEDs, such as epoxy resin and silicone resin, face issues with low light transmittance, poor light resistance, and inadequate heat resistance, surface hardness, and thermal shock resistance, which are not adequately addressed by existing solutions.
Innovation Solution
A curable composition comprising a linear polysiloxane with alkenyl groups and a silicon compound containing hydrogen atoms, which undergoes a hydrosilylation reaction to form a cross-linked polysiloxane network, providing enhanced refractive index, crack resistance, and thermal shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy resin is used as LED encapsulation material, then adhesive property and dynamic durability are improved, but light transmittance and light resistance deteriorate
Solution Approach 1:
The patent uses a composite material system consisting of a silicone resin base polymer and a cyclic siloxane crosslinking agent. This composite approach combines the excellent light resistance of silicone resin with the high crosslinking density and adhesive properties achieved through cyclic siloxane crosslinking, thereby simultaneously improving both adhesive property and light transmittance while resolving the contradiction with conventional epoxy resin.
2Strength
If epoxy resin is used as LED encapsulation material, then adhesive property is improved, but light resistance deteriorates
Solution Approach 1:
The patent employs a composite material system combining silicone resin base polymer with cyclic siloxane crosslinking agent. The silicone resin provides inherent light resistance while the cyclic siloxane crosslinking enhances adhesive property and structural stability, achieving both high light resistance and adhesive property simultaneously.
Solution Approach 2:
The patent changes the chemical parameters of the encapsulation material by using a cyclic siloxane crosslinking agent with specific ring structures (5-membered or 6-membered rings). This parameter change in the crosslinking mechanism creates a three-dimensional network structure that simultaneously improves adhesive property and light resistance, overcoming the limitations of conventional epoxy resin.
3Reliability
If silicone resin is used as encapsulation material, then light resistance is improved, but heat resistance and surface hardness deteriorate
Solution Approach 1:
The patent changes the crosslinking parameters by introducing cyclic siloxane crosslinking agents that form dense three-dimensional networks. This parameter change increases the crosslinking density and structural rigidity, thereby improving heat resistance and surface hardness while maintaining the excellent light resistance inherent to silicone resin.
Solution Approach 2:
The patent creates a composite material system where silicone resin base polymer is crosslinked with cyclic siloxane compounds. This composite structure combines the light resistance of silicone resin with the enhanced thermal stability and surface hardness provided by the cyclic siloxane crosslinked network.
4Reliability
If silicone resin is used as encapsulation material, then light resistance is improved, but surface hardness and thermal shock resistance deteriorate
Solution Approach 1:
The patent modifies the crosslinking parameters by using cyclic siloxane crosslinking agents that create dense three-dimensional networks. This increases the crosslinking density and structural rigidity, thereby improving surface hardness and thermal shock resistance while preserving the excellent light resistance of silicone resin.
Solution Approach 2:
The patent employs a composite material system combining silicone resin with cyclic siloxane crosslinking agents. The cyclic siloxane crosslinking creates a rigid three-dimensional network that enhances surface hardness and thermal shock resistance, while the silicone resin matrix maintains excellent light resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition exhibits excellent processability, high refractive index, low moisture permeability, and improved adhesive and thermal properties, preventing surface stickiness and color changes under high-temperature or high-humidity conditions, making it suitable for LED encapsulation.
Implementation Method 1
a curable composition comprising a linear polysiloxane (A) and a silicon compound, and characterized in that the linear polysiloxane (A) includes siloxane units of the following Formulas (1) to (3)... the curable composition which is cured by a hydrosilylation reaction
Data Source
AI summary
A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.