Curable Polyurethane Thermal Interface Composition for Low Adhesion
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Solution Overview
Problem
Existing heat dissipation materials face challenges in achieving low adhesion force to adherends while maintaining high thermal conductivity, and they often require rapid curing which limits application and replacement times.
Innovation Solution
A curable composition that forms a thermal interface material with low adhesion force to adherends without plasticizers, featuring controlled curing rates and excellent curability, using a polyurethane composition with specific reactive compounds and fillers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If silicone resin is used as the resin binder to achieve low adhesion force, then adhesion force is reduced, but cost increases and contact failure occurs
Solution Approach 1:
The patent modifies the chemical structure of polyurethane resin by introducing specific parameters: using polyols with hydrocarbon groups (Formula 1) and controlling the ratio of hard segment to soft segment. This parameter change transforms the inherently high-adhesion polyurethane into a material with low adhesion force while maintaining reliability, without using silicone resin or plasticizers.
Solution Approach 2:
The patent creates a composite thermal interface material by combining modified polyurethane resin (with specific hydrocarbon group structures) with thermally conductive fillers. This composite approach achieves low adhesion force and high thermal conductivity simultaneously, replacing the need for silicone resin binders.
2Productivity
If curing speed is increased to improve productivity, then curing time is reduced, but application and replacement time window shrinks
Solution Approach 1:
The patent introduces dynamic control of the curing process by using a catalyst system that can be activated or deactivated. The catalyst allows the composition to remain in a workable state during application, then accelerates curing once positioned, providing a dynamic time window that extends the application period while maintaining fast final curing.
Solution Approach 2:
The composition is formulated to undergo preliminary curing reactions that increase viscosity gradually, allowing extended application time. The reactive compounds and catalyst are designed to initiate curing only after application, creating a preliminary phase where the material remains workable for positioning and adjustment.
3Force
If plasticizer is added to reduce adhesion force, then adhesion force decreases, but material properties deteriorate and plasticizer elution occurs
Solution Approach 1:
The patent extracts and eliminates the need for plasticizers by fundamentally modifying the polyurethane resin structure itself. Instead of adding external adhesion-reducing agents, the invention builds the low-adhesion property into the polymer backbone through hydrocarbon group incorporation, removing the harmful element while achieving the desired effect.
Solution Approach 2:
The patent replaces expensive silicone resin with a cost-effective modified polyurethane system that achieves similar low-adhesion performance without the reliability issues. The modified polyurethane provides a durable, non-eluting solution that maintains its properties throughout the service life.
4Temperature
If polyurethane material is used to achieve high thermal conductivity, then thermal conductivity is improved, but adhesion force increases
Solution Approach 1:
The patent changes the fundamental parameters of polyurethane chemistry by incorporating polyols with specific hydrocarbon groups (Formula 1) and controlling the hard/soft segment ratio. This parameter modification reduces adhesion force while preserving the high thermal conductivity capability of polyurethane, enabling it to compete with silicone resin for thermal interface applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low adhesion force to adherends, high thermal conductivity, and controlled curing rates, allowing for flexible application and extended working times without compromising material properties.
Implementation Method 1
a process of applying the heat dissipation material before curing to the desired location, and then curing it is performed
Data Source
AI summary
A curable composition or thermal interface material, and the like can exhibit low adhesion force to a given adherend while exhibiting high thermal conductivity. Also, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The curable composition can also exhibit a precisely controlled curing rate and simultaneously have excellent curability. A product may comprise the curable composition, or a cured body or thermal interface material thereof.