Curable Resin Film for Low-Transmittance Carrier Release
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices using a temporary fixing method with a carrier face challenges in efficiently producing devices with a curable resin film that provides adequate tackiness and low light transmissivity for easy separation from the carrier.
Innovation Solution
A curable resin film with tackiness and low light transmissivity is developed, featuring a support film, a curable resin film with a light absorbing agent, and a method for producing semiconductor devices that includes forming a temporary fixing laminated body and removing the carrier using laser irradiation, ensuring efficient semiconductor device manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a curable resin film with tackiness is used for temporary fixing, then bonding strength to carrier and chips is improved, but light transmissivity increases making separation difficult
Solution Approach 1:
The patent changes the optical parameter (light transmissivity) of the curable resin film by incorporating a light absorbing agent, while maintaining the bonding parameter (tackiness) through proper resin formulation. This allows the film to have both strong bonding capability and low light transmissivity (20% or less at 355 nm), resolving the contradiction between bonding strength and light transmissivity.
Solution Approach 2:
The curable resin film is formulated as a composite material containing both tackifying agents (for bonding strength) and light absorbing agents (for low transmissivity). This composite approach allows simultaneous achievement of strong adhesion to carrier and chips while blocking UV light to facilitate easy separation after curing.
2Adaptability or versatility
If the carrier is removed after sealing, then device flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The curable resin film is designed with preliminary separation functionality - the light absorbing agent is incorporated before curing so that after the film cures and provides structural support, UV light irradiation can easily separate the carrier from the sealed device. This preliminary design of separation capability simplifies the removal process while maintaining manufacturing flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin film effectively adheres to the carrier and semiconductor chips, allowing for efficient manufacturing with improved bonding and handling properties, while the low light transmissivity facilitates easy separation from the carrier, enhancing the reliability and flexibility of the semiconductor devices.
Implementation Method 1
The curable resin film exhibits a transmittance of 20% or less with respect to light at a wavelength of 355 nm
Implementation Method 2
The curable resin film with tackiness effectively adheres to the carrier and semiconductor chips, allowing for efficient manufacturing with improved bonding and handling properties
Implementation Method 3
The protective layer is a cured curable resin film that is cured. The temporary fixing laminated body is formed by a method including adhering the curable resin film and the carrier
Data Source
AI summary
A method for producing a semiconductor device, including forming a temporary fixing laminated body including a carrier, and a sealing structure body provided on a main surface of the carrier, and removing the carrier from the temporary fixing laminated body. The temporary fixing laminated body is formed by a method including adhering the curable resin film and the carrier. The carrier is removed from the temporary fixing laminated body by separating a protective layer that is the curable resin film that is cured from the carrier. The curable resin film exhibits a transmittance of 20% or less with respect to light at a wavelength of 355 nm when cured.