Curable Resin Composition Adhesion to Conductor Layers
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Solution Overview
Problem
Conventional curable resin compositions used in multilayered printed wiring boards face challenges in achieving sufficient adhesiveness to conductor layers, leading to potential peeling issues and inadequate electrical performance.
Innovation Solution
Incorporating a triazole compound and a tertiary amine compound into an epoxy-based curable resin composition, along with an active ester compound and optionally a polyphenylene ether compound, to enhance adhesiveness and reduce dielectric loss tangent, thereby improving the bonding between electrical insulating layers and conductor layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional curable resin composition is used, then manufacturing process is simple, but adhesiveness to conductor layers is insufficient
Solution Approach 1:
The patent applies composite materials by combining epoxy resin with specific additives including triazole compound (B) and tertiary amine compound (C) in defined proportions. This composite approach creates a multi-functional resin system that simultaneously achieves excellent adhesiveness to conductor layers, low dielectric loss tangent, and appropriate storage stability, resolving the contradiction between improved strength and increased complexity.
Solution Approach 2:
The patent employs parameter changes by precisely controlling the content ranges of triazole compound (0.01-13 parts by mass per 100 parts epoxy resin) and tertiary amine compound (0.01-13 parts by mass per 100 parts epoxy resin). These parameter optimizations enable the resin composition to achieve maximum adhesiveness while maintaining storage stability, effectively balancing performance improvement with composition complexity.
2Reliability
If conventional curable resin composition is used, then composition is simple, but electrical properties are insufficient
Solution Approach 1:
The patent creates a composite resin system incorporating epoxy resin, triazole compound, and tertiary amine compound that achieves low dielectric loss tangent and excellent electrical properties. The synergistic interaction between these components produces superior electrical performance that cannot be achieved with conventional single-component or simpler formulations.
Solution Approach 2:
The patent optimizes electrical properties through precise parameter control of additive concentrations, specifically maintaining triazole and tertiary amine compounds within 0.01-13 parts by mass per 100 parts epoxy resin. This parameter optimization ensures low dielectric loss tangent while managing the complexity of the multi-component system.
3Strength
If conventional curable resin composition is used, then manufacturing is easy, but adhesiveness is weak causing peeling
Solution Approach 1:
The patent develops a composite curable resin composition containing epoxy resin, triazole compound, and tertiary amine compound that achieves excellent adhesiveness to conductor layers, preventing peeling during manufacturing and use. The synergistic combination of these components creates a formulation that bonds effectively to conductors while remaining practical to manufacture.
Solution Approach 2:
The patent optimizes manufacturing performance by controlling the content of triazole and tertiary amine compounds within specific ranges (0.01-13 parts by mass per 100 parts epoxy resin each). This parameter control ensures maximum adhesiveness while maintaining ease of manufacture and storage stability.
4Reliability
If conventional curable resin composition is used, then composition is simple, but dielectric loss tangent is high degrading signals
Solution Approach 1:
The patent creates a composite resin system where epoxy resin is combined with triazole compound and tertiary amine compound to achieve low dielectric loss tangent. This composite formulation minimizes signal degradation in multilayered printed wiring boards while maintaining a manageable composition structure through defined component relationships.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified curable resin composition achieves excellent adhesiveness to conductor layers, ensuring reliable bonding and reduced signal transmission loss, particularly at high frequencies, thus enhancing the performance of multilayered printed wiring boards.
Implementation Method 1
a cured object having excellent adhesiveness to conductor layers can be formed
Implementation Method 2
a cured object obtained by curing a curable resin composition has been used as the electrical insulating layer
Data Source
AI summary
The purpose of the present invention is to provide a curable resin composition capable of forming a cured object having excellent adhesiveness to conductor layers. The curable resin composition according to the present invention comprises an epoxy compound (A), a triazole compound (B), and a tertiary amine compound (C) represented by the following formula (I). In formula (I), R1 and R2 each independently represent -(R3O)nH (wherein R3 represents a C2-3 alkylene group and n is an integer of 1-3).