Curable Resin Composition for Electronic Coating
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Solution Overview
Problem
Existing curable resin compositions for electrical and electronic applications lack sufficient coating properties, flexibility before curing, and heat resistance, while also requiring improved insulating and adhesive properties after curing.
Innovation Solution
A curable resin composition combining a polyfunctional epoxy compound with trifunctional and tetrafunctional epoxy compounds, a polyfunctional cyanic acid ester, and an imidazole curing agent, specifically formulated to enhance coating properties, reduce tackiness, and improve heat resistance and insulating properties, with optional inclusion of a silane coupling agent and filler for enhanced adhesion and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional epoxy resin compositions are used, then basic adhesive properties are achieved, but coating properties and flexibility before curing are insufficient
Solution Approach 1:
The patent modifies the chemical structure parameters of the epoxy compound by selecting specific trifunctional and tetrafunctional epoxy compounds with defined molecular weights and structural characteristics. This parameter optimization enables the composition to achieve both excellent coating properties and flexibility before curing, resolving the technical contradiction between ease of operation and reliability.
2Temperature
If high crosslinking density epoxy resins are used, then heat resistance is improved, but insulating properties and coating properties deteriorate
Solution Approach 1:
The patent creates a composite curing system combining cyanic acid ester and imidazole compound curing agents with the epoxy resin. This composite approach achieves high heat resistance through crosslinking while maintaining good insulating properties and coating characteristics, resolving the contradiction between heat resistance and insulating properties.
Solution Approach 2:
The patent optimizes the molecular structure parameters of the epoxy compound and the ratio of curing agents to achieve a balanced crosslinking density that provides high heat resistance while preserving insulating properties and coating properties.
3Strength
If conventional epoxy compositions are used, then basic adhesive properties are achieved, but adhesion to base materials and thermal conductivity are insufficient
Solution Approach 1:
The patent formulates a composite resin composition incorporating epoxy resin, cyanic acid ester, imidazole compound, and functional fillers. This composite structure enhances both adhesive properties through chemical bonding and thermal conductivity through filler incorporation, resolving the contradiction between strength and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent coating properties, flexibility before curing, and high heat resistance and insulating properties after curing, with improved adhesion to base materials and thermal conductivity, making it suitable for various electronic applications.
Implementation Method 1
A curable resin composition containing (A) 100 parts by mass of polyfunctional epoxy component which contains (A1) a trifunctional epoxy compound having three glycidyl groups in a molecule and (A2) a tetrafunctional epoxy compound having four glycidyl groups in a molecule
Implementation Method 2
a curing agent of imidazole compound, a resin composition, a resin sheet formed by using said curable resin composition and cured materials thereof which are excellent in an electrical performance, adhesive properties and a heat resistance
Data Source
AI summary
A curable resin composition which comprising (A), (B) and (C) as follows: (A) 100 parts by mass of polyfunctional epoxy component which contains (A1) a trifunctional epoxy compound having three glycidyl groups in a molecule and (A2) a tetrafunctional epoxy compound having four glycidyl groups in a molecule, wherein (A1):(A2) is 10:90 to 90:10 in terms of mass; (B) 25 to 200 parts by mass of a cyanic acid ester compound having two or more of cyanato groups; and (C) 0.5 to 20 parts by mass of an imidazole compound as a curing agent.