Curable Resin Composition with Optimized Filler Distribution
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Solution Overview
Problem
Conventional potting materials and adhesives for electronic components face challenges with low fluidity, poor workability, and insufficient heat dissipation, especially when incorporating inorganic fillers for thermal conductivity, leading to issues like cracking, insufficient curing, and increased viscosity.
Innovation Solution
A curable resin composition comprising a (meth)acrylate monomer, organic peroxide, decomposition accelerator, and spherical alumina filler with specific particle size distribution, which is air-curable at room temperature, providing flexibility and high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an inorganic filler is incorporated in a large amount to impart thermal conductivity, then thermal conductivity is improved, but viscosity increases and fluidity deteriorates
Solution Approach 1:
The patent applies parameter changes by carefully controlling the particle size distribution parameters of the inorganic filler. Specifically, it uses a median diameter of 5 to 40 μm and mode diameter of 30 to 70 μm, which optimizes the balance between thermal conductivity and fluidity. This parameter optimization allows sufficient heat dissipation while maintaining good workability and preventing excessive viscosity increase.
Solution Approach 2:
The patent creates a composite material system combining (meth)acrylate monomer with specifically distributed inorganic filler particles. The composite achieves both high thermal conductivity and good fluidity through the synergistic effect of the monomer matrix and optimally distributed filler particles, resolving the contradiction between thermal performance and processing ease.
2Temperature
If an inorganic filler is incorporated to impart thermal conductivity, then thermal conductivity is improved, but the cured product becomes hard and heat cycle resistance deteriorates
Solution Approach 1:
The patent uses parameter changes in the particle size distribution (median diameter 5 to 40 μm, mode diameter 30 to 70 μm) to achieve a balanced cured product that maintains both thermal conductivity and flexibility. This specific parameter range prevents excessive hardening while ensuring adequate heat dissipation, thereby improving heat cycle resistance.
Solution Approach 2:
The patent applies local quality by creating a non-uniform particle size distribution where different sized particles fulfill different functions. The specific distribution ensures that the filler provides thermal conductivity where needed while maintaining overall flexibility of the cured product, resolving the contradiction between thermal performance and reliability.
3Reliability
If epoxy resin is used for potting treatment, then heat insulation and water resistance are improved, but the cured product has very high modulus causing stress and cracks
Solution Approach 1:
The patent replaces expensive epoxy resin with (meth)acrylate monomer, which offers comparable or superior performance at lower cost. The acrylate-based composition achieves adequate water resistance and protection while maintaining low modulus and flexibility, avoiding the stress and cracking problems associated with high-modulus epoxy resins.
Solution Approach 2:
The patent creates a composite material using (meth)acrylate monomer combined with specifically distributed inorganic filler. This composite achieves the desired balance of water resistance, flexibility, and thermal conductivity, replacing the problematic high-modulus epoxy resin system with a more suitable material composition.
4Reliability
If silicone resin is used as RTV rubber, then low temperature resistance and heat resistance are improved, but low molecular siloxane causes continuity failure and abrasion
Solution Approach 1:
The patent replaces expensive silicone resin with (meth)acrylate monomer, which is more cost-effective and environmentally friendly. The acrylate-based system achieves comparable temperature resistance without generating harmful siloxane impurities, eliminating the continuity failure and abrasion problems associated with silicone resin decomposition.
Solution Approach 2:
The patent extracts and eliminates the harmful low molecular siloxane component by completely replacing the silicone resin system with (meth)acrylate monomer. This extraction of the harmful element is achieved through material substitution, maintaining the beneficial temperature resistance while removing the source of continuity failure and abrasion.
5Reliability
If conventional acrylic resin is used, then durability is improved, but the cured product is hard and poor in heat cycle resistance
Solution Approach 1:
The patent applies parameter changes by using (meth)acrylate monomer instead of conventional acrylic resin, which fundamentally changes the curing characteristics and mechanical properties. The monomer-based system produces a cured product with lower modulus and improved flexibility while maintaining durability and heat cycle resistance, resolving the hardness-related contradictions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition offers improved fluidity and workability, enabling efficient heat dissipation, flexibility, and enhanced heat cycle resistance, while being cost-effective and environmentally friendly, suitable for electronic component sealing and bonding applications.
Implementation Method 1
an organic peroxide as a polymerization initiator is added to an acrylic monomer or oligomer, and radicals are generated by thermolysis of the organic peroxide to polymerize the acrylic monomer or oligomer
Implementation Method 2
radicals are generated by thermolysis of the organic peroxide to polymerize the acrylic monomer or oligomer
Implementation Method 3
an inorganic filler having thermal conductivity such as silica or alumina is incorporated for the purpose of releasing heat generated from the electronic components
Data Source
AI summary
It is to provide a curable resin composition which is curable at room temperature, has fluidity, is excellent in workability and provides a cured product having high thermal conductivity and being excellent in flexibility.A curable resin composition comprising a (meth)acrylate monomer, an organic peroxide, a decomposition accelerator for the organic peroxide, and an inorganic filler, wherein the inorganic filler has a particle size distribution such that it has peak diameters at least in the respective regions of from 3 to 10 μm and from 30 to 70 μm, and the mode diameter is from 30 to 70 μm and the median diameter is from 5 to 40 μm.