Curable Resin Composition Hydrosilylation Catalyst
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Solution Overview
Problem
Current addition-curable organic silicon resin compositions used for encapsulating semiconductor elements face issues with crack resistance and productivity due to insufficient hardness and heat resistance, particularly when the silphenylene skeleton is modified with only two hydrosilyl groups, leading to slow curing rates and brittleness.
Innovation Solution
A curable resin composition comprising an organic silicon compound with three or more hydrosilyl groups and an organic silicon compound with two or more alkenyl groups, along with a hydrosilylation catalyst, to enhance curing rate and hardness, while maintaining the silphenylene skeleton for improved mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If silphenylene is modified with only two hydrosilyl groups, then the resin maintains flexibility, but the curing rate becomes too slow to attain sufficient hardness
Solution Approach 1:
The patent changes the key parameter of hydrosilyl group quantity from two to three or more groups per silphenylene skeleton. This parameter change directly increases the curing rate by providing more reactive sites while simultaneously achieving sufficient hardness through enhanced crosslinking density, resolving the contradiction between curing speed and final hardness.
Solution Approach 2:
The patent creates a composite molecular structure combining silphenylene skeleton with multiple hydrosilyl groups and alkenyl groups. This composite structure enables both rapid curing (through multiple hydrosilyl groups reacting with alkenyl groups) and adequate hardness (through the rigid silphenylene core), simultaneously satisfying both requirements.
2Productivity
If silphenylene is modified with only two hydrosilyl groups, then the resin structure is simpler, but the productivity is inferior
Solution Approach 1:
The patent increases the functional group count parameter to three or more hydrosilyl groups, which dramatically accelerates the curing reaction and reduces production time. Although this increases molecular complexity, the productivity gain outweighs the structural complexity, as the faster curing rate compensates for the more complex synthesis process.
3Temperature
If silphenylene having only two hydrosilyl groups is used, then the synthesis process is simpler, but the compound does not have a high boiling point enough to be used directly
Solution Approach 1:
The patent constructs a composite molecular architecture where the silphenylene core is functionalized with three or more hydrosilyl groups and alkenyl groups. This composite structure increases molecular weight and intermolecular interactions, thereby raising the boiling point to suitable levels for direct use, while maintaining a relatively straightforward synthesis pathway through known organic silicon chemistry.
4Reliability
If a soft silicone resin in the form of a gel or rubber is used, then crack resistance is improved, but the resin sticks to the mold during compression molding
Solution Approach 1:
The patent adjusts the crosslinking density parameter by incorporating three or more hydrosilyl groups per silphenylene unit. This creates an optimized network structure that provides adequate flexibility for crack resistance while maintaining sufficient rigidity to prevent sticking to molds during compression molding, resolving the contradiction between crack resistance and mold release.
5Strength
If the silphenylene skeleton is incorporated to provide toughness, then the resin becomes rigid with high hardness, but the curing rate becomes too slow
Solution Approach 1:
The patent creates a composite functional structure where the silphenylene skeleton provides toughness and rigidity, while multiple hydrosilyl groups (three or more) and alkenyl groups enable rapid addition curing. This composite design allows the resin to simultaneously achieve high toughness from the silphenylene core and fast curing from the multiple reactive functional groups.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves rapid curing and produces a cured product with superior hardness and mechanical strength, addressing the limitations of existing compositions by ensuring excellent crack resistance and heat resistance.
Implementation Method 1
an addition-curable organic silicon resin composition comprising an organic silicon compound having at least two alkenyl groups in a molecule, an organic silicon compound having at least three hydrosilyl groups each bonded to a carbon atom of the benzene ring
Data Source
AI summary
One of the purposes of the present invention is to provide a curable resin composition which has good curability and provides a cured product having a sufficient hardness, in particular an addition-curable organic silicon resin composition. The present invention provides a curable resin composition comprising the following components (A) to (C): (A) an organic-silicon compound having at least two alkenyl groups in a molecule, (B) an organic silicon compound which is represented by the formula (I) and has at least three hydrosilyl groups each bonded to the carbon atom of the benzene ring in an amount such that a ratio of the number of the hydrosilyl group in component (B) to the number of the alkenyl group in component (A) is 0.4 to 4,and (C) a hydrosilylation catalyst in a catalytic amount.