Curable Resin Composition for Optical Semiconductor Encapsulation
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Solution Overview
Problem
Current encapsulants for optical semiconductor devices face challenges in achieving a balance between transparency, heat resistance, light resistance, and gas barrier properties, particularly for high-brightness and high-current applications, with existing methyl silicone and phenyl silicone-based materials falling short in preventing electrode corrosion and maintaining flexibility over time.
Innovation Solution
A curable resin composition comprising a polyorganosiloxane with an adjusted structural unit ratio, blended with a zirconium compound and a hydrosilylation catalyst, which forms a cured product with enhanced transparency, heat resistance, light resistance, and flexibility, effectively preventing transmittance reduction and hardness rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If methyl silicone-based encapsulants are used for high brightness and high current lighting applications, then heat resistance and light resistance are improved, but gas barrier properties against corrosive gas remain insufficient
Solution Approach 1:
The patent employs a composite material system combining phenyl silicone resin and methyl silicone resin in specific proportions (phenyl silicone resin: 1-50 wt%, methyl silicone resin: 50-99 wt%). This composite approach leverages the excellent gas barrier properties of phenyl silicone resin while maintaining the superior heat and light resistance of methyl silicone resin, thereby resolving the contradiction between heat resistance and gas barrier properties.
2Reliability
If phenyl silicone-based encapsulants are used to improve gas barrier properties, then electrode corrosion prevention is enhanced, but heat resistance and light resistance deteriorate
Solution Approach 1:
The patent applies parameter changes by precisely controlling the composition ratio of phenyl silicone resin (1-50 wt%) and methyl silicone resin (50-99 wt%), along with specific molecular weight ranges (Mc: 100-10,000 for phenyl silicone, Mn: 500-50,000 for methyl silicone) and crosslinking agent content (0.1-10 wt%). These parameter optimizations enable the cured product to achieve both excellent gas barrier properties and superior heat/light resistance, resolving the contradiction between these properties.
3Temperature
If methyl silicone resin composition is used for high brightness applications, then heat resistance and light resistance are improved, but hardness increases and flexibility is lost over time
Solution Approach 1:
The patent applies local quality by introducing specific structural units with different functions into the polysiloxane chain. The incorporation of Q units (SiO4/2) and T units (RSiO3/2) creates localized regions with different properties: Q units enhance heat resistance and chemical stability, while T units maintain flexibility and processability. This local differentiation within the polymer structure resolves the contradiction between heat resistance and flexibility.
Solution Approach 2:
The composite material system combining phenyl silicone resin and methyl silicone resin, along with specific crosslinking agents, creates a heterogeneous network structure where different components contribute different properties. The phenyl silicone resin provides gas barrier properties and flexibility, while methyl silicone resin provides heat and light resistance, resolving the contradiction between these properties in the cured encapsulant.
4Illumination intensity
If encapsulants with high transparency and heat resistance are used, then optical performance is improved, but gas barrier properties against corrosive gas deteriorate
Solution Approach 1:
The patent applies parameter changes by optimizing the molecular weight parameters (Mc: 100-10,000 for phenyl silicone resin, Mn: 500-50,000 for methyl silicone resin) and composition ratios. These parameter optimizations enable the cured product to achieve both high transparency (maintaining optical performance) and excellent gas barrier properties, resolving the contradiction between these properties for high-brightness LED applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin composition ensures high transparency and flexibility in optical semiconductor devices, preventing electrode corrosion and maintaining luminous intensity over time, thereby increasing the durability of optical semiconductor devices for high-brightness and high-current applications.
Implementation Method 1
a curable resin composition comprising a polyorganosiloxane (A), a polyorganosiloxane (B), a zirconium compound (C), and a hydrosilylation catalyst (D)
Implementation Method 2
a curable resin composition comprising a polyorganosiloxane (A), a polyorganosiloxane (B), a zirconium compound (C), and a hydrosilylation catalyst (D)
Data Source
AI summary
The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility.The present invention provides a curable resin composition comprising the following components:(A): a polyorganosiloxane represented by the average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1;(B) a polyorganosiloxane represented by the average composition formula:R2mHnSiO[(4-m-n)/2]wherein R2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.5, and 0.8≤m+n≤3;(C): a zirconium compound; and(D): a hydrosilylation catalyst.