Curable Resin Composition for Optical Semiconductor Encapsulation
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Solution Overview
Problem
Current encapsulants for optical semiconductor devices face challenges in providing adequate gas barrier properties against corrosive gases like H2S and SOX, while also maintaining heat resistance and light resistance, leading to electrode corrosion and reduced luminous intensity due to tackiness and dust attachment.
Innovation Solution
A curable resin composition comprising specific polyorganosiloxane components with adjusted structural unit ratios and the inclusion of alkyl and aryl groups, along with a hydrosilylation catalyst, is developed to form a less tacky, high-barrier, heat-resistant, and light-resistant cured product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If methyl silicone-based encapsulants are used to achieve heat resistance and light resistance, then transparency and heat/light resistance are improved, but surface becomes tacky causing dust attachment and decreased luminous intensity
Solution Approach 1:
The invention optimizes the compositional parameters by incorporating phenyl silicone compound at controlled concentrations (0.1-10 mass%). This parameter adjustment fundamentally changes the surface properties of the cured encapsulant, eliminating tackiness and preventing dust attachment while preserving the excellent heat and light resistance of the methyl silicone base.
2Reliability
If coating liquid is applied to electrode before encapsulation or gold is used to prevent corrosion, then corrosion prevention is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention makes the encapsulant material itself multi-functional by incorporating phenyl silicone compound into the methyl silicone-based polymer. This single material simultaneously provides mechanical protection, heat resistance, light resistance, and corrosion prevention, eliminating the need for separate electrode coating steps or expensive gold plating, thus simplifying manufacturing while maintaining excellent corrosion protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin composition effectively prevents electrode corrosion and maintains high luminous intensity by providing enhanced gas barrier, heat resistance, and light resistance, ensuring the durability of optical semiconductor devices.
Implementation Method 1
a curable resin composition comprising the following components (A), (B), and (C): (A) a polyorganosiloxane... (B) a polyorganosiloxane... (C) a hydrosilylation catalyst
Data Source
AI summary
An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C):(A): a polyorganosiloxane represented by the following average unit formula:(SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 wherein each R1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R1, and a1>0, a2>0, a3≥0, a4>0, 0.5≤a1/a2≤10, and a1+a2+a3+a4=1;(B) a polyorganosiloxane represented by the following average composition formula:R2mHnSiO[(4−m−n)/2]wherein R2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.0, and 0.8≤m+n≤3; and(C): a hydrosilylation catalyst.