Curable Resin Composition for Printed Wiring Boards
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Solution Overview
Problem
Conventional materials for printed wiring boards, such as polyphenylene ether, face challenges with insufficient solder heat resistance, mechanical strength reduction at high temperatures, and poor compatibility between components, leading to inadequate heat resistance, chemical resistance, and electrical properties.
Innovation Solution
A curable resin composition comprising a polyphenylene ether oligomer with vinyl groups on both terminals and a solvent-soluble polyfunctional vinyl aromatic copolymer, along with optional thermoplastic or thermosetting resins and fillers, to enhance heat resistance, chemical resistance, and electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyphenylene ether is used as material for printed wiring board, then excellent electrical properties and mechanical properties are achieved, but solder heat resistance is insufficient and material deforms at high temperatures of 200°C or higher
Solution Approach 1:
The patent combines polyphenylene ether with curing agents (epoxy resins, phenolic resins, cyanate esters, or isocyanates) to create a composite material system. This composite approach allows the base polyphenylene ether to provide excellent electrical properties while the curing agent forms a crosslinked network that provides the necessary heat resistance and dimensional stability at temperatures of 200°C and above.
Solution Approach 2:
The patent modifies the chemical structure and crosslinking density of the polyphenylene ether composite by adjusting the type and amount of curing agent used. This parameter change enables the material to maintain its electrical properties while achieving the required heat resistance through controlled crosslinking that prevents deformation at high temperatures.
2Temperature
If crosslinking functional groups are introduced into polyphenylene ether chain to improve heat resistance, then heat resistance improves, but the material becomes brittle and loses flexibility
Solution Approach 1:
The patent carefully controls the crosslinking degree by selecting appropriate curing agents and optimizing their proportions. This parameter control ensures sufficient heat resistance while preventing excessive crosslinking that would cause brittleness. The patent specifies particular curing agents and their用量 to achieve the optimal balance between heat resistance and flexibility.
Solution Approach 2:
The patent uses a composite system where polyphenylene ether is combined with specific curing agents in controlled ratios. This composite approach allows the polyphenylene ether chains to maintain their flexibility while the crosslinked network provides heat resistance, avoiding the brittleness that would result from direct crosslinking of the polyphenylene ether chains alone.
3Ease of manufacture
If large amount of plasticizer is used to improve formability of cured polyphenylene ether, then vacuum lamination becomes possible, but electrical properties (dielectric constant and dissipation factor) and heat resistance are degraded
Solution Approach 1:
The patent achieves formability through controlled crosslinking of the polyphenylene ether-curing agent composite system, eliminating the need for plasticizers. By adjusting the crosslinking density and network structure through proper curing agent selection and processing conditions, the patent enables vacuum lamination and other forming operations while maintaining the excellent electrical properties and heat resistance of the polyphenylene ether base material.
4Reliability
If polyphenylene ether is used to achieve excellent dielectric properties, then low dielectric constant is achieved, but chemical resistance to aromatic hydrocarbons and halogen-substituted hydrocarbons is very low
Solution Approach 1:
The patent creates a composite material where polyphenylene ether is combined with curing agents to form a crosslinked network structure. This composite structure provides both the excellent dielectric properties of polyphenylene ether and improved chemical resistance to aromatic hydrocarbons and halogen-substituted hydrocarbons through the crosslinked network that resists solvent attack.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved heat resistance, chemical resistance, and electrical properties, preventing mechanical strength reduction at high temperatures and ensuring compatibility, making it suitable for advanced technology fields like electronics and aerospace.
Implementation Method 1
introducing a crosslinking functional group into a chain of polyphenylene ether, curing the whole
Implementation Method 2
heat-curing the resultant
Data Source
AI summary
Provided is curable resin composition which gives a cured article excellent in chemical resistance, dielectric properties, low water-absorption, heat resistance, flame retardance, and mechanical properties and which is usable in applications such as dielectric materials, insulating materials, heat-resistant materials, and structural materials. The curable resin composition includes a component (A) which is a polyphenylene ether oligomer having a number-average molecular weight of 700 to 4,000 and having a vinyl group at both end and a component (B) which is a solvent-soluble polyfunctional vinylaromatic copolymer which has structural units derived from monomers including a divinylaromatic compound (a) and an ethylvinylaromatic compound (b) and in which the content of repeating units derived from the divinylaromatic compound (a) is 20 mol % or higher, the ratio of the amount (wt. %) of the component (A) to that (wt. %) of the component (B) being (20 to 98):(2 to 80). The composition can further contain a layered silicate, a halogenated flame retardant, etc.