Curable Resin Composition for Semiconductor Devices
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Solution Overview
Problem
Current curable resin compositions do not adequately address the need for high-temperature stability in applications such as semiconductor devices, despite offering high heat resistance, and there is a lack of effective materials for such stringent usage conditions.
Innovation Solution
A curable resin composition incorporating a multifunctional benzoxazine compound, specific epoxy compounds with norbornane and naphthylene ether structures, and a curing agent, along with optional inorganic fillers and curing accelerators, which upon curing, provides enhanced heat resistance and high-temperature stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional curable resin compositions are used, then heat resistance is achieved, but high-temperature stability is insufficient for stringent usage conditions
Solution Approach 1:
The patent employs a composite resin system combining benzoxazine resin with specific epoxy resins (containing norbornane or naphthylene ether structures) and curing agents. This composite approach creates a synergistic effect where the benzoxazine provides heat resistance while the epoxy components enhance high-temperature stability, achieving both required properties simultaneously in the cured product.
Solution Approach 2:
The patent modifies the chemical structure parameters of the resin components by selecting specific epoxy compounds with norbornane or naphthylene ether structures and controlling the functional group ratios. By adjusting these molecular parameters and curing conditions, the cured product achieves enhanced high-temperature stability while maintaining heat resistance, resolving the contradiction between the two properties.
2Reliability
If multifunctional benzoxazine compounds and specific epoxy compounds are combined, then heat resistance and high-temperature stability are improved, but formulation complexity increases
Solution Approach 1:
The patent selects epoxy compounds with specific structures (norbornane or naphthylene ether) that serve multiple functions: they provide high-temperature stability, contribute to heat resistance, and ensure proper curing characteristics. This multi-functionality reduces the need for additional specialized additives, simplifying the overall formulation while achieving the desired performance.
Solution Approach 2:
The patent applies local quality by specifying particular structural features (norbornane or naphthylene ether groups) in the epoxy components rather than using general epoxy resins. This targeted structural specification ensures high-temperature stability is achieved through specific molecular characteristics, allowing for a more focused and potentially simpler formulation approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent heat resistance, high-temperature stability, and dimensional stability, making it suitable for demanding applications like semiconductor devices with improved reliability and sealing performance.
Implementation Method 1
a multifunctional benzoxazine compound having at least two benzoxazine rings... upon curing, provides enhanced heat resistance and high-temperature stability
Implementation Method 2
an epoxy compound having at least one norbornane structure and at least two epoxy groups... a naphthylene ether type epoxy compound... and a curing agent
Data Source
AI summary
The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).