Curable Resin Composition for Solder Resist Adhesion and Insulation
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Solution Overview
Problem
Current curable resin compositions for solder resist in printed wiring boards face challenges in achieving both high insulation reliability and adhesiveness, particularly in high-temperature environments and with varying substrate pretreatment methods, while also requiring resistance to plating and durability.
Innovation Solution
A curable resin composition incorporating an imidazole-isocyanate adduct as a catalyst, combined with a carboxyl group-containing resin and a thermosetting resin, which enhances adhesiveness and insulation reliability, and allows for pattern formation by light exposure, thereby improving the properties of the solder resist.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a strong roughening treatment is applied to the substrate, then the anchor effect is improved, but the adhesiveness of the resin insulating layer deteriorates
Solution Approach 1:
The invention changes the chemical parameters of the resin composition by incorporating specific components (imidazole-isocyanate adduct, carboxyl group-containing resin, thermosetting resin) that enable strong adhesion to substrates without requiring aggressive mechanical roughening, thus resolving the contradiction between anchor effect and adhesiveness
Solution Approach 2:
The invention uses a composite resin system combining multiple resin types (epoxy resin, carboxyl group-containing resin, thermosetting resin) that work synergistically to provide both strong substrate bonding and adequate anchor effect, eliminating the need to choose between roughening treatment and adhesiveness
2Productivity
If the density of printed wiring boards is increased, then the insulation reliability deteriorates, but the performance of electronic devices is improved
Solution Approach 1:
The invention modifies the electrical and insulating parameters of the solder resist composition by adding specific resins and curing agents that enhance dielectric strength and insulation performance, allowing higher wiring density without compromising insulation reliability
Solution Approach 2:
The invention uses a cost-effective resin composition formulation that provides high insulation performance through chemical composition rather than expensive alternative materials or complex manufacturing processes
3Temperature
If the installation temperature is increased, then the insulation reliability deteriorates, but the functionality of electronic devices in high-temperature environments is improved
Solution Approach 1:
The invention changes the thermal stability parameters of the resin composition by incorporating thermosetting resins and appropriate curing agents that maintain insulation properties at elevated temperatures, enabling reliable operation in high-temperature environments like automobile engine rooms
Solution Approach 2:
The invention uses a thermosetting resin system that undergoes complete curing to form a cross-linked network structure before service, providing preemptive thermal stability and insulation reliability that withstands high-temperature conditions without degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent adhesiveness and insulation reliability, maintaining necessary properties like resistance to plating and durability, and enables effective pattern formation by light exposure, even in high-temperature conditions, thus addressing the limitations of existing resin compositions.
Implementation Method 1
incorporating an imidazole-isocyanate adduct as a catalyst
Implementation Method 2
a curable resin composition containing (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin
Implementation Method 3
allows for pattern formation by light exposure
Data Source
AI summary
The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition.