Curable Resin Composition for Copper Adhesion and Chemical Resistance
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Solution Overview
Problem
Existing curable resin compositions used in semiconductor devices suffer from low metal adhesiveness, particularly with metals like copper, which affects the performance and reliability of the resulting semiconductor devices.
Innovation Solution
A curable resin composition containing a polymer precursor with a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of 1 mmol/g or less, along with a photopolymerization initiator and onium salts or thermal-base generators, is used to enhance metal adhesiveness and chemical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional curable resin compositions are used, then manufacturing adaptability is maintained, but metal adhesiveness is insufficient
Solution Approach 1:
The patent modifies the chemical parameters of the curable resin composition by incorporating specific heterocyclic ring-containing polymer precursors with controlled acid values (0.01-10 mmol/g) and specific functional groups. This changes the chemical composition parameters to enhance metal adhesiveness while maintaining compatibility with existing manufacturing processes
Solution Approach 2:
The patent creates a composite curable resin composition by combining heterocyclic ring-containing polymer precursors with conventional resin components, photopolymerization initiators, and curing agents. This composite approach achieves improved metal adhesiveness while preserving manufacturing adaptability through compatibility with existing materials
2Reliability
If conventional curable resin compositions are used, then ease of operation is maintained, but chemical resistance is insufficient
Solution Approach 1:
The patent changes the chemical composition parameters by incorporating heterocyclic ring structures with specific acid values and functional groups, which inherently provide improved chemical resistance while maintaining ease of application through standard coating methods
3Reliability
If the acid value of the polymer precursor is increased, then metal adhesiveness is improved, but chemical permeation increases
Solution Approach 1:
The patent precisely controls the acid value parameter within the optimal range of 0.01-10 mmol/g, which balances metal adhesiveness enhancement with chemical permeation resistance. This parameter optimization ensures both improved metal bonding and reduced chemical penetration
Solution Approach 2:
The patent employs a composite polymer precursor system combining heterocyclic ring structures with specific functional groups that work synergistically to achieve both high metal adhesiveness and low chemical permeation, overcoming the trade-off between these two properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved adhesiveness and chemical resistance, leading to better performance and reliability of semiconductor devices by enhancing interactions with metals and reducing chemical permeation.
Implementation Method 1
a curable resin composition containing a heterocyclic ring-containing polymer precursor and a photopolymerization initiator
Implementation Method 2
the heterocyclic ring-containing polymer precursor is cyclized by heating or the like, whereby a cured resin can be formed on the base material
Data Source
AI summary
There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.