Curable Resin Composition for Low-Dielectric Copper-Safe Packaging
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Solution Overview
Problem
Existing resin materials for semiconductor packages and printed circuit boards suffer from copper corrosion and inadequate low dielectric properties, particularly in high-frequency applications, which affect transmission loss and reliability.
Innovation Solution
A curable resin composition is developed by reacting specific compounds represented by formulas (1), (2-1), and (2-2) with a molar ratio of (β1+β2)/α between 1.8 and 2.1, ensuring low dielectric dissipation factors and heat resistance, and using a basic catalyst in an aprotic polar solvent to enhance reactivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If phenolic hydroxy groups are used in the resin composition, then the resin has good moldability and reactivity, but the electrical properties deteriorate due to remaining unreacted groups after curing
Solution Approach 1:
The patent removes the harmful phenolic hydroxy groups that remain unreacted after curing by using a resin composition where these groups are either absent or fully reacted. This extraction of the problematic functional group eliminates the electrical property deterioration while preserving the beneficial moldability through alternative curing mechanisms.
Solution Approach 2:
The patent changes the chemical composition parameters of the resin system by selecting specific combinations of compounds (such as cyanate esters, polyimides, or polyamides) that cure without leaving harmful phenolic hydroxy groups. This parameter change in the resin formulation achieves both good moldability and electrical properties.
2Quantity of substance
If copper wires are used instead of gold wires, then the cost decreases and electrical conductivity improves, but copper corrosion occurs reducing package reliability
Solution Approach 1:
The patent converts the potentially harmful effect of copper corrosion into a beneficial outcome by using a resin composition that actively prevents corrosion. The resin system is designed to create a protective environment that not only prevents corrosion but also maintains low dielectric properties, turning the risk into an advantage for reliability.
Solution Approach 2:
The patent creates an inert chemical environment through the resin composition that prevents copper corrosion. The resin system forms a protective barrier and uses chemical stability to prevent reactions with copper, effectively creating a corrosive-resistant atmosphere around the copper wiring.
3Reliability
If thermoplastic materials such as PTFE and LCP are used to achieve low dielectric properties, then transmission loss decreases, but moldability becomes poor compared to thermosetting resins
Solution Approach 1:
The patent uses a composite resin system combining multiple components (such as cyanate esters with polyimides or polyamides) that leverages the low dielectric properties of thermoplastic-like materials while incorporating thermosetting characteristics for excellent moldability. This composite approach achieves both low transmission loss and good manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively prevents copper foil corrosion and maintains excellent low dielectric properties, suitable for high-frequency applications, meeting the requirements of 5G communication systems and semiconductor encapsulation.
Implementation Method 1
A compound obtained by reacting a compound represented by formula (1) with a compound represented by formula (2-1) and/or a compound represented by formula (2-2)
Data Source
AI summary
The present invention provides: a compound which exhibits excellent heat resistance and low dielectric characteristics without corroding copper foils; a curable resin composition; and a cured product of this curable resin composition. This compound is obtained by causing a compound represented by formula (1), a compound represented by formula (2-1) and/or a compound represented by formula (2-2) to react with each other; and if a is the number of moles of the compound represented by formula (1), β1 is the number of moles of the compound represented by formula (2-1) and β2 is the number of moles of the compound represented by formula (2-2), (β1+β2)/α is 1.8 to 2.1.