Curable Resin Dye Layer for Image Sensor Color Shading
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Solution Overview
Problem
The existing image sensor chips face issues with color shading due to increased incident angle dependence of light when the solid-state imaging device substrate and infrared ray cut filter are not closely contacted, leading to suboptimal performance.
Innovation Solution
A curable resin composition is developed that includes a dye with a maximum absorption wavelength between 600 to 850 nm, which forms a dye-containing layer in conjunction with an infrared ray reflecting film, allowing for close contact with the solid-state imaging device substrate without a space, thereby reducing light angle dependence and suppressing color shading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a space is left between the solid-state imaging device substrate and the infrared ray cut filter, then the assembly is easier to manufacture, but incident angle dependence of light increases causing color shading
Solution Approach 1:
A curable resin composition is introduced as an intermediary material between the solid-state imaging device substrate and the infrared ray cut filter. This resin fills the space between the two components, enabling close contact while maintaining ease of assembly through coating processes. The resin's curable properties allow it to set in the gap, ensuring optical contact without requiring precision mechanical alignment.
Solution Approach 2:
The patent utilizes the curable property of the resin composition, which changes from a liquid/coatable state to a solid state through curing. This parameter change allows the resin to initially flow and fill the gap between components for easy assembly, then harden to maintain stable, close contact that prevents color shading. The solid content concentration and viscosity parameters are optimized to enable this transformation.
2Manufacturing precision
If the incident angle dependence of light is reduced by close contact, then color shading is suppressed, but the complexity of achieving close contact increases
Solution Approach 1:
The curable resin composition serves as a mediator that simplifies the achievement of close contact. Instead of requiring complex mechanical structures or precision alignment mechanisms to ensure contact between the substrate and filter, the resin is simply coated onto one surface and cured, automatically filling any gaps and ensuring optical contact through its flow and setting properties.
Solution Approach 2:
The resin composition forms a thin film layer between the substrate and filter that adapts to surface irregularities. This thin film approach is simpler than rigid mechanical contact structures, as it can conform to minor surface variations while maintaining the necessary optical contact to suppress color shading effects.
3Reliability
If a dye-containing layer with film thickness of 20 μm or more is formed, then the infrared ray cut filter functionality is improved, but the amount of material and coating complexity increases
Solution Approach 1:
The patent optimizes the solid content concentration and viscosity parameters of the curable resin composition to achieve the required 20 μm or more film thickness with appropriate material quantity. By controlling these parameters, the resin can be applied in a single coating process that achieves the necessary thickness for effective infrared ray cutting without requiring excessive material or multiple coating steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin composition effectively produces image sensor chips with reduced color shading and improved light reception characteristics by ensuring the infrared ray cut filter and substrate are closely contacted, enhancing the image sensor's performance.
Implementation Method 1
contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm
Implementation Method 2
curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more
Data Source
AI summary
There is provided a curable resin composition which is capable of being coated so as to have a film thickness of 20 μm or more and contains a dye having a maximum absorption wavelength in a wavelength range from 600 to 850 nm, and the infrared ray cut filter having a dye-containing layer having a film thickness of 20 μm or more formed from the curable resin composition, and a production method of image sensor chip comprising a step of coating the curable resin composition on a glass substrate to form a dye-containing layer, and a step of adhering the glass plate having the dye-containing layer formed on a solid-state imaging device substrate.