Curable Resin Composition for Low-Temperature Fast Curing
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Solution Overview
Problem
Current curable resin compositions fail to achieve fast curability at low temperatures while maintaining high heat resistance, which is essential for applications such as semiconductor sealants and composites.
Innovation Solution
A curable resin composition comprising a multifunctional benzoxazine compound, an epoxy compound with a norbornane structure, a trisphenolmethane type epoxy compound, and a curing agent, along with optional inorganic fillers and curing accelerators, which allows for rapid curing at low temperatures and produces a cured product with high glass transition temperature and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional curable resin compositions are used, then heat resistance can be maintained, but curability at low temperature is slow
Solution Approach 1:
The patent combines multiple resin systems (benzoxazine, epoxy, phenolic) in a composite formulation to achieve both fast low-temperature curability and high heat resistance. The benzoxazine component provides rapid curing at low temperatures, while the epoxy and phenolic components contribute to high heat resistance in the final cured product.
Solution Approach 2:
The patent modifies the chemical composition parameters of the curable resin by incorporating specific ratios of multifunctional benzoxazine compounds, epoxy compounds, and phenolic compounds. This parameter optimization enables the resin to cure rapidly at low temperatures while maintaining high heat resistance.
2Ease of manufacture
If fast curability at low temperature is achieved, then formability is enhanced, but heat resistance may be compromised
Solution Approach 1:
The composite resin system integrates fast-curing benzoxazine components with heat-resistant epoxy and phenolic components, enabling both excellent formability through rapid low-temperature curing and high heat resistance in the final product.
Solution Approach 2:
The curable resin composition is designed to perform multiple functions: rapid curing at low temperatures for easy manufacturing, and providing high heat resistance for stringent usage conditions. The multifunctional benzoxazine compound and blended resin system enable this multi-functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables fast curability at low temperatures (around 160-180°C) and achieves high heat resistance, making it suitable for applications requiring both properties, such as semiconductor sealants and composites, with improved fluidity and sealing performance.
Implementation Method 1
a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings
Implementation Method 2
benzoxazine resins as cured products (polymerized products) thereof are excellent in physical properties such as heat resistance and mechanical strength
Data Source
AI summary
The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).