Curable Resin Composition for Low-Dielectric Heat-Resistant Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing resin materials for semiconductor packages and 3D printing applications lack sufficient heat resistance, low dielectric loss tangent, and moisture resistance, leading to issues such as warpage, poor electrical properties, and moisture absorption, which are critical for advanced electronic components and 5G communication systems.
Innovation Solution
A curable resin composition comprising a compound represented by specific organic groups and a dehydrohalogenation reaction, producing a cured product with improved heat resistance, low dielectric properties, and enhanced curability, using a mixture with a polymerization inhibitor and polyphenylene ether compound.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a phenolic hydroxyl group is used in the resin composition, then heat resistance is improved, but electrical properties deteriorate due to residual hydroxyl groups after curing
Solution Approach 1:
The patent changes the chemical structure parameters by substituting phenolic hydroxyl groups with allyl groups, transforming the resin from a phenolic structure to an allyl ether structure. This parameter change allows the resin to maintain heat resistance while eliminating residual hydroxyl groups that harm electrical properties, as the allyl groups fully participate in curing reactions.
Solution Approach 2:
The patent applies local quality by specifically modifying the hydroxyl group locations with allyl substitutions at controlled positions (indicated by m and n parameters in the formula). This selective modification ensures that heat resistance is maintained at critical locations while electrical properties are improved by eliminating problematic residual groups.
2Volume of moving object
If the PKG substrate thickness is reduced to meet size requirements, then device density is improved, but warpage increases due to low rigidity
Solution Approach 1:
The patent changes the material parameters by developing a resin composition with specifically controlled molecular weight distribution (Mn: 200-5000, Mw: 2000-5000) and chemical structure (allyl ether of phenol with controlled substitution patterns). These parameter changes result in a cured product with high rigidity and Tg equal to or higher than solder mounting temperature, enabling thin substrates to resist warpage during high-temperature processing.
3Ease of manufacture
If conventional epoxy resin is used for sealing material, then manufacturing ease is improved, but heat resistance deteriorates for high-temperature applications
Solution Approach 1:
The patent creates a composite material system by combining allyl ether of phenol with specific curing agents (amine compounds, carboxylic acid compounds, or their anhydrides). This composite approach maintains the ease of manufacturing through standard curing processes while achieving heat resistance suitable for SiC semiconductor applications and other high-temperature environments.
4Adaptability or versatility
If photocurable or thermosetting resins are used for 3D printing, then manufacturing versatility is improved, but moisture resistance deteriorates due to ester bonds and hydroxyl groups
Solution Approach 1:
The patent changes the chemical composition parameters by eliminating ester bonds and hydroxyl groups from the resin structure, replacing them with ether bonds and allyl groups that do not hydrolyze. This parameter change maintains the versatility of 3D printing applications while dramatically improving moisture resistance, making the cured products suitable for structural members and electronic encapsulation in humid environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cured product exhibits excellent heat resistance, low dielectric properties, and improved stability, suitable for sealing electronic components and 3D printing applications, addressing warpage and moisture absorption issues.
Implementation Method 1
a dehydrohalogenation reaction in the presence of a basic catalyst
Implementation Method 2
a curing reaction, and thus, it cannot be said that the electrical properties are sufficient
Implementation Method 3
A mixture containing the compound described in any one of the aforementioned items [1] to [5] and a polymerization inhibitor
Data Source
AI summary
A compound of formula 1:where X and Y are each a different optional organic group. When there is a plurality of X, each X in the plurality of X may be the same as or different from each other. When there is a plurality of Y, each Y in the plurality of Y may be the same as or different from each other. R represents a hydrocarbon group having 1 to 10 carbon atoms or a halogenated alkyl group. When there is a plurality of R, each R in the plurality of R may be the same as or different from each other. Variable m is an integer of 0 to 3, n is a repeating unit and satisfies 1≤n≤20, and p is a repeating unit and satisfies 0≤p≤20.