Curable Resin Composition With Low Viscosity and Heat Resistance
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Solution Overview
Problem
The viscosity of curable resins with a -C(CF3)2- structure is high, making them difficult to handle industrially, and they tend to crystallize easily, which complicates their application in materials like insulating and semiconductor encapsulants.
Innovation Solution
A curable resin with a -CH(CF3)- structure is developed, which has a lower viscosity and does not crystallize easily, achieved by reacting a bisphenol compound with epihalohydrin and incorporating a polymerizable functional group, allowing for improved flexibility and handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If curable resin with -C(CF3)2- structure is used, then heat resistance and adhesive strength are improved, but viscosity becomes high and handling becomes difficult
Solution Approach 1:
The patent changes the chemical structure parameter from -C(CF3)2- to -CH(CF3)-, which fundamentally alters the molecular geometry and intermolecular interactions. This structural modification reduces the viscosity while preserving the heat resistance properties, as the asymmetric -CH(CF3)- group disrupts crystallization and reduces molecular packing efficiency compared to the symmetric -C(CF3)2- group.
2Reliability
If curable resin with -C(CF3)2- structure is used, then thermal degradation resistance is improved, but the resin crystallizes easily
Solution Approach 1:
The patent introduces asymmetry by replacing the symmetric -C(CF3)2- group with the asymmetric -CH(CF3)- group. This asymmetry prevents regular molecular packing and crystallization, while the CF3 groups remain to provide thermal stability through their strong C-F bonds and low polarizability.
3Reliability
If curable resin with -C(CF3)2- structure is used, then UV degradation resistance is improved, but filler incorporation becomes difficult
Solution Approach 1:
The structural parameter change from -C(CF3)2- to -CH(CF3)- reduces viscosity and improves fluidity, enabling better wetting and dispersion of fillers. The CF3 groups maintain UV resistance by providing steric protection and low polarizability, while the reduced viscosity allows homogeneous filler incorporation.
4Reliability
If curable resin with -C(CF3)2- structure is used, then moisture absorption resistance is improved, but the resin is difficult to handle industrially
Solution Approach 1:
The asymmetric -CH(CF3)- structure prevents crystallization and reduces viscosity, improving processability and industrial handling. The CF3 groups maintain moisture resistance through their hydrophobic nature and low polarity, while the asymmetric structure ensures the resin remains fluid and easy to process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin with a -CH(CF3)- structure has a balanced low viscosity and good heat resistance, facilitating easier filler incorporation and forming a homogeneous film, while maintaining high heat resistance and improved electrical properties.
Implementation Method 1
a curable resin represented by General Formula (1)... R2 represents a hydrogen atom, an epoxy group, or a polymerizable functional group
Data Source
AI summary
A curable resin represented by General Formula (1). In General Formula (1), R1 each independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R2's are each independently a monovalent group including a polymerizable functional group.