Active Energy Ray-Curable Resin Composition With Low-Viscosity Handling
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Solution Overview
Problem
Curable resin compositions with high viscosity components face handling difficulties, limiting their usable design range and application flexibility.
Innovation Solution
A curable resin composition containing a crosslinkable compound with a specific structure, a high viscosity oligomer, and a polymerization initiator, which maintains low viscosity while achieving properties like thermal degradation resistance, hardness, adhesion, and weather resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a high viscosity component is used in the curable resin composition, then the cured product achieves desired physical properties such as thermal degradation resistance, hardness, adhesion, and weather resistance, but the composition itself becomes difficult to handle due to high viscosity
Solution Approach 1:
The patent applies parameter changes by carefully controlling the viscosity of the oligomer component within specific ranges (viscosity at 25°C of 100-10,000 mPa·s or viscosity at 60°C of 50-2,000 mPa·s) and adjusting the compositional ratios of crosslinkable compound, oligomer, and polymerization initiator. This optimization allows the curable resin composition to maintain low viscosity for easy handling while ensuring the cured product achieves desired physical properties including thermal degradation resistance, hardness, adhesion, and weather resistance.
2Ease of operation
If the curable resin composition is designed to have low viscosity for ease of handling, then handling becomes easy, but it becomes difficult to achieve desired physical properties in the cured product
Solution Approach 1:
The patent employs composite materials by formulating a curable resin composition that combines crosslinkable compounds (having polymerizable groups for curing), oligomers (providing viscosity control and physical properties), and polymerization initiators (enabling curing reaction). This composite formulation synergistically achieves both low viscosity for ease of handling and desired physical properties in the cured product, including thermal degradation resistance, hardness, adhesion, and weather resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a balanced viscosity and desired properties, suitable for various applications including coatings, inks, sealants, and molding materials.
Implementation Method 1
active energy ray-curable resin composition containing: a crosslinkable compound (A), an oligomer (B) having a viscosity at 25° C. of 1000 mPa·s or higher or a viscosity at 60° C. of 400 mPa·s or higher, and a polymerization initiator (C)
Data Source
AI summary
The present invention aims to provide a curable resin composition that can retain low viscosity and exhibit properties appropriate for application, even when the curable resin composition contains a high viscosity component. The present invention relates to an active energy ray-curable resin composition containing: a crosslinkable compound (A); an oligomer (B) having a viscosity at 25° C. of 1000 mPa·s or higher or a viscosity at 60° C. of 400 mPa·s or higher; and a polymerization initiator (C), the crosslinkable compound (A) being represented by the following formula (1):wherein Z is an n-valent linking group, with n being an integer of 2 or greater.