Curable Resin Composition for Optical Semiconductor Encapsulants
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Solution Overview
Problem
Current encapsulants for optical semiconductor devices face challenges in achieving a balance between high heat resistance, light resistance, and gas barrier properties, with methyl silicone-based encapsulants providing good heat and light resistance but inadequate corrosion prevention, and phenyl silicone-based encapsulants offering good gas barrier properties but inferior heat and light resistance. Additionally, existing solutions are complex and costly, and the cured products used in thin and small devices are brittle and difficult to handle.
Innovation Solution
A curable resin composition is developed, comprising specific ratios of polyorganosiloxanes with alkyl and aryl groups, hydrosilyl groups, and a hydrosilylation catalyst, which upon curing, forms a material with high toughness, flexibility, and controlled viscosity, suitable for use as an encapsulant or lens in optical semiconductor devices, maintaining mechanical characteristics even at increased hardness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If methyl silicone-based encapsulant is used, then heat resistance and light resistance are improved, but gas barrier property against corrosive gases deteriorates
Solution Approach 1:
The patent uses a composite resin composition containing both methyl silicone resin and phenyl silicone resin components. This composite approach combines the heat resistance and light resistance of methyl silicone with the gas barrier properties of phenyl silicone, resolving the contradiction between these properties.
Solution Approach 2:
The patent modifies the chemical composition parameters by controlling the ratio of methyl silicone resin to phenyl silicone resin, and adjusting the crosslinking density through catalyst and filler selection. This parameter optimization achieves both high heat resistance and improved gas barrier properties simultaneously.
2Object-affected harmful factors
If phenyl silicone-based encapsulant is used, then gas barrier property is improved, but heat resistance and light resistance deteriorate
Solution Approach 1:
The patent creates a composite system where phenyl silicone resin provides gas barrier properties while methyl silicone resin maintains heat resistance. The synergistic combination eliminates the weakness of each individual component.
Solution Approach 2:
The patent assigns different functional roles to different resin components within the composite: phenyl silicone resin segments provide gas barrier function while methyl silicone resin segments maintain thermal stability, achieving localized property optimization.
3Strength
If hardness is increased to enhance strength, then mechanical strength is improved, but flexibility and handling ease deteriorate
Solution Approach 1:
The patent optimizes the crosslinking density and molecular weight distribution of the resin components to achieve a balance between strength and flexibility. By controlling the ratio of crosslinking agents and curing conditions, the material attains adequate mechanical strength while maintaining processing flexibility.
Solution Approach 2:
The composite resin system combines rigid phenyl silicone segments for strength with flexible methyl silicone segments for handling ease, creating a material that exhibits both high mechanical strength and good flexibility simultaneously.
4Ease of operation
If viscosity is decreased to improve handling, then ease of operation is improved, but mechanical strength of cured product deteriorates
Solution Approach 1:
The patent controls the viscosity of the uncured resin composition by adjusting molecular weight and adding appropriate flow modifiers, while ensuring that the cured product achieves high strength through optimized crosslinking chemistry and catalyst selection.
Solution Approach 2:
The patent creates a dynamic system where the resin transitions from a low-viscosity liquid state (easy to handle) to a high-strength crosslinked network (mechanically strong) through controlled curing conditions and catalyst activity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin composition achieves high transparency and luminous intensity under high luminance and temperature, enhances durability against stress in thin and small devices, and simplifies handling while maintaining excellent mechanical properties.
Implementation Method 1
a curable resin composition containing: a component (A), a component (B), a component (C), a component (D), and a component (E) below; (A) a polyorganosiloxane... (D) a polyorganosiloxane... having a SiH group... (E) a hydrosilylation catalyst
Data Source
AI summary
An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts.(A): A polyorganosiloxane represented by average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 R1 is alkyl, aryl, alkenyl, or the like; a proportion of the alkyl is from 30 to 98 mol %, a proportion of the aryl is from 1 to 50 mol %, and a proportion of the alkenyl is from 1 to 20 mol % relative to a total amount of R1; and a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1.(B): A polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %.(C): An organopolysiloxane represented by average unit formula below: (RxSiO3/2)x1(Rx2SiO2/2)x2(Rx2SiRARx2SiO2/2)x3(Rx3SiO1/2)x4 where Rx is alkyl, aryl, alkenyl, or the like; a proportion of the aryl relative to a total amount of Rx is from 1 to 50 mol %, and at least two of all the Rx moieties are alkenyl; RA is a divalent hydrocarbon group; and 0.05>x1≥0, x2+x3>0, x4>0, and x1+x2+x3+x4=1.(D) A polyorganosiloxane represented by average composition formula below:R2mHnSiO[(4-m-n)/2]where R2 is alkyl or aryl, and at least two silicon atoms are bonded to hydrogen atoms; and 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3.(E): A hydrosilylation catalyst.