Curable Resin Composition for Printed Circuit Boards
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Solution Overview
Problem
Current curable resin compositions for printed circuit boards lack sufficient strength and toughness, particularly in terms of resistance to tearing, breaking, distortion, and torsion, which limits their performance and reliability.
Innovation Solution
A curable resin composition comprising a thermoplastic resin with two glass transition points and a thermosetting component, along with an alkali-soluble component and photopolymerization initiators, which forms a nanocylinder structure upon curing, enhancing mechanical properties and stress relaxation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional curable resin compositions are used, then basic solder resist functionality is achieved, but strength and toughness are insufficient
Solution Approach 1:
The invention uses a composite resin system combining thermoplastic resin (providing toughness and elasticity) with thermosetting resin (providing strength and rigidity). This composite structure creates a cured product that simultaneously achieves high strength, toughness, and resistance to mechanical stresses including tearing, breaking, distortion, and torsion.
Solution Approach 2:
The invention introduces a nanocylinder structure with specific glass transition points (Tgx > 30°C and Tgy ≤ Tgx - 20°C) at the molecular level within the resin matrix. This localized structural organization provides enhanced mechanical properties and stress relaxation capabilities specifically at critical stress points, improving overall reliability without compromising general strength.
2Strength
If the resin composition is optimized for strength, then mechanical properties improve, but printability and developability may deteriorate
Solution Approach 1:
The invention carefully controls the glass transition point parameters (Tgx > 30°C and Tgy ≤ Tgx - 20°C) of the thermoplastic resin to optimize the balance between mechanical strength and processing properties. By adjusting these thermal parameters, the resin maintains printability and developability while achieving enhanced mechanical strength in the cured state.
Solution Approach 2:
The nanocylinder structure provides localized reinforcement at the molecular level without affecting the macroscopic flow and development properties of the resin. This allows the material to exhibit different properties at different scales: enhanced strength at the nanoscale while maintaining good printability and developability at the macroscale.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent strength and toughness, reducing the likelihood of cracks and improving the overall performance of the cured product as a solder resist, while maintaining printability and developability.
Implementation Method 1
at least one of a photopolymerization initiator (D-1) and a photo-base generator (D-2)
Data Source
AI summary
An alkaline development-type curable resin composition having an excellent strength against tearing, breaking, distortion and torsion, and excellent toughness, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are disclosed. A curable resin composition is obtained, which contains (A) a thermoplastic resin, (B) a thermosetting component, (C) an alkali-soluble component, and at least one of (D-1) a photopolymerization initiator and (D-2) a photo-base generator, the thermoplastic resin (A) having two or more glass transition points including two glass transition points Tgx and Tgy, which satisfy Tgx>30° C. and Tgy<0° C. and the thermosetting component (B) having a glass transition point Tgz, which satisfies Tgz≧Tgy+20° C. Moreover, a cured product of the curable resin composition, a printed circuit board having the cured product, and a process for manufacturing the cured product are obtained.