Curable Resin Composition for Semiconductor Package Warpage Reduction
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Solution Overview
Problem
Semiconductor packages face warpage issues due to mismatched linear expansion coefficients between resins and metals, leading to problems like cracking and damage during heat-molding processes, and existing solutions compromise on thermal resistance or resin strength.
Innovation Solution
A curable resin composition containing an organic compound with carbon-carbon double bonds reactive with SiH groups, a compound with SiH groups, a hydrosilylation catalyst, a silicone compound, and an inorganic filler, which reduces warpage and enhances thermal resistance when integrated with metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large amount of inorganic filler is added to lower the linear expansion of resin, then the linear expansion coefficient of resin is reduced to be closer to metal, but the fluidity of resin during molding is reduced and molding processability is deteriorated
Solution Approach 1:
The patent uses a composite resin system combining silicone resin and phenolic resin with specific inorganic fillers (silica, alumina) to achieve both low linear expansion coefficient matching metal substrates and adequate molding processability. The composite structure allows synergistic effects where the resin matrix provides processability while fillers control thermal expansion.
Solution Approach 2:
The patent optimizes the composition parameters including the ratio of silicone resin to phenolic resin, the type and amount of inorganic fillers, and the molecular weight distribution to achieve the desired balance between linear expansion coefficient and molding processability. Specific parameter ranges are defined to resolve the contradiction.
2Shape
If the elastic modulus of resin is lowered to reduce warpage, then warpage is reduced, but the strength of resin is reduced leading to loss of protection function
Solution Approach 1:
The patent employs a composite system of silicone resin and phenolic resin with controlled inorganic filler content to achieve an optimal elastic modulus that reduces warpage while maintaining sufficient strength. The dual-resin system provides flexibility to manage thermal stress while preserving structural integrity for semiconductor protection.
Solution Approach 2:
The patent creates different local properties within the resin composition by strategically distributing inorganic fillers and using different resin phases to provide both flexibility for warpage reduction and localized strength for protection, rather than uniform properties throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin composition achieves reduced warpage and improved thermal resistance, ensuring the semiconductor package's integrity and performance.
Implementation Method 1
an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst
Data Source
AI summary
The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.