Curable Resin Composition for Warpage Reduction
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Solution Overview
Problem
The challenge is to develop a curable resin composition that balances strength and elasticity to minimize warpage in laminates of cured products and substrates, where the linear expansion coefficients differ, while ensuring effective stress relaxation.
Innovation Solution
A curable resin composition comprising a first epoxy resin with a polyoxyalkylene chain, a second epoxy resin, a thermoplastic resin with a weight average molecular weight of 300,000 or less, and an inorganic filler, which forms a curable sheet that achieves balanced strength and flexibility, allowing for stress relaxation and reduced warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the strength of the cured product is increased, then the strength is improved, but the elasticity is also increased, causing a severer warpage in the laminate
Solution Approach 1:
The patent changes the molecular weight parameter of the thermoplastic resin to 300,000 or less, which fundamentally alters the material's mechanical properties. This parameter change enables the cured product to achieve both high strength and reduced elasticity, thereby suppressing warpage while maintaining structural integrity
Solution Approach 2:
The patent creates a composite material system combining epoxy resin with specific thermoplastic resin (molecular weight ≤300,000) and inorganic filler. This composite approach allows the material to simultaneously exhibit high strength from the epoxy network and controlled elasticity from the thermoplastic phase, resolving the warpage issue while maintaining strength
2Reliability
If a sealing sheet is brought into close contact with the substrate and cured, then sealing is achieved, but warpage occurs due to different linear expansion coefficients
Solution Approach 1:
The patent modifies the thermal and mechanical parameters of the sealing material by using thermoplastic resin with molecular weight ≤300,000. This parameter change reduces the linear expansion coefficient mismatch between the sealing layer and substrate, thereby suppressing warpage while maintaining effective sealing
Solution Approach 2:
The patent addresses thermal expansion mismatch by selecting thermoplastic resin with specific molecular weight characteristics that reduce the difference in linear expansion coefficients between the cured sealing material and the substrate, thereby minimizing warpage during thermal cycling while maintaining sealing integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition ensures a cured product with enhanced strength and flexibility, effectively reducing warpage in laminates and allowing for stress relaxation over time, making it suitable for sealing substrates and electronic components.
Implementation Method 1
a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group
Implementation Method 2
allowing for stress relaxation and reduced warpage
Implementation Method 3
a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin
Implementation Method 4
curable resin composition for forming a cured product through curing by the action of heat or the like
Data Source
AI summary
A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.