Curable Silicone Composition Low-Temperature Curing
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Solution Overview
Problem
Conventional curable silicone compositions require high temperatures for curing, which can cause deformation in sensitive substrates like performance plastics with lower melting points, limiting their application in diverse end-use environments.
Innovation Solution
A curable composition comprising an organopolysiloxane with silicon-bonded aliphatically unsaturated groups, an organohydrogensiloxane, a hydrosilylation-reaction catalyst, a hydrosilylation-reaction inhibitor, and a catalyst that deactivates the inhibitor at lower temperatures (50-120°C), allowing for curing without damaging sensitive substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional curable silicone compositions are used with high curing temperatures, then complete curing and crosslinking is achieved, but substrate deformation occurs due to excessive heat
Solution Approach 1:
The invention changes the temperature parameter from conventional high temperatures (>150°C) to a lower temperature range (50-120°C) by introducing a two-catalyst system. This parameter change enables complete curing while avoiding substrate deformation, directly resolving the technical contradiction between curing completeness and substrate integrity.
Solution Approach 2:
The invention introduces a first catalyst (e.g., tin octoate) as an intermediary that activates the curing reaction at lower temperatures, replacing the conventional single high-temperature catalyst system. This intermediary catalyst enables the reaction to proceed completely at temperatures that do not deform the substrate.
2Duration of action of stationary object
If reaction inhibitors are used to prevent premature curing, then shelf life is improved, but higher curing temperatures are required to deactivate the inhibitors
Solution Approach 1:
The invention changes the temperature parameter required to deactivate the reaction inhibitor from >150°C to 50-120°C through the use of a first catalyst system (e.g., tin octoate). This parameter change maintains the shelf-life benefit of using reaction inhibitors while eliminating the need for high curing temperatures that cause substrate deformation.
3Strength
If high curing temperatures are applied to achieve complete polymerization, then crosslinking density is improved, but energy consumption increases
Solution Approach 1:
The invention changes the temperature parameter from high temperatures (>150°C) to lower temperatures (50-120°C) while maintaining complete crosslinking density through the use of a first catalyst system. This parameter change achieves the same crosslinking quality with significantly reduced energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition achieves excellent shelf-life and stability, enabling curing at lower temperatures, thus broadening its application on various substrates, including performance plastics, without causing deformation.
Implementation Method 1
a hydrosilylation-reaction catalyst; components (A) and (B) react in the presence of at least component (C)
Implementation Method 2
a catalyst different from component (C) and capable of deactivating the (D) hydrosilylation-reaction inhibitor at an elevated temperature of from 50 to 120° C.
Data Source
AI summary
A curable composition is disclosed. The curable composition comprises: (A) an organopolysiloxane containing at least two silicon-bonded aliphatically unsaturated groups per molecule; (B) an organohydrogensiloxane containing at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; (D) a hydrosilylation-reaction inhibitor; and (E) a catalyst different from component (C) and capable of deactivating the (D) hydrosilylation-reaction inhibitor at an elevated temperature of from 50 to 120 C such that components (A) and (B) react in the presence of at least component (C) at the elevated temperature. A process of preparing a coated substrate with the curable composition is also disclosed.