Curable Silicone Composition for Optical Semiconductor Encapsulation
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Solution Overview
Problem
Conventional curable silicone compositions with high refractive indices for optical semiconductor devices suffer from insufficient wettability on glass substrates and form wrinkled surfaces, leading to insufficient smoothness.
Innovation Solution
Incorporating a small amount of a linear organopolysiloxane or cerium-containing organopolysiloxane, where aryl groups account for no more than 30 mol% of silicon atom-bonded functional groups, into an aryl group-containing curable silicone composition to enhance wetting properties and prevent wrinkling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional curable silicone compositions with high refractive indices are used, then the refractive index is improved, but the wettability on glass substrates deteriorates and wrinkled surfaces form
Solution Approach 1:
The patent modifies the chemical composition parameters of the silicone resin by incorporating specific organopolysiloxanes with controlled aryl group content (no more than 30 mol%) and adding glass powder with specific surface treatments. This parameter optimization enables the cured product to achieve both high refractive index (1.45 or more) and excellent wettability on glass substrates, preventing wrinkled surface formation while maintaining optical properties.
Solution Approach 2:
The patent creates a composite material system combining silicone resin (with specific organopolysiloxane composition), glass powder (with surface treatment), and crosslinking agents. This composite approach allows the cured product to simultaneously achieve high refractive index, excellent adhesion to glass substrates, and smooth surface formation, resolving the contradiction between optical performance and wettability.
2Illumination intensity
If conventional curable silicone compositions with high refractive indices are used, then the refractive index is improved, but the surface smoothness deteriorates due to wrinkling
Solution Approach 1:
The patent optimizes composition parameters including the ratio of organopolysiloxanes with different aryl group contents (no more than 30 mol%), glass powder particle size distribution, and crosslinking agent amounts. These parameter adjustments ensure the cured product achieves high refractive index while maintaining excellent surface smoothness and preventing wrinkle formation during curing.
Solution Approach 2:
The patent develops a composite formulation combining specifically selected silicone resin components, surface-treated glass powder, and crosslinking agents. This composite material system provides both high refractive index and wrinkle-free smooth surfaces, simultaneously satisfying optical performance and surface quality requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified composition exhibits excellent wetting properties on glass substrates and forms a smooth surface, preventing wrinkling and ensuring a high refractive index while maintaining optical semiconductor device encapsulation quality.
Implementation Method 1
a curable silicone composition, comprising: (A-1) a resinous alkenyl group-containing organopolysiloxane; (A-2) a linear alkenyl group-containing organopolysiloxane; (B) a linear organopolysiloxane or a cerium-containing organopolysiloxane; (C) an organohydrogenpolysiloxane; and (D) a catalyst for hydrosilylation reaction
Data Source
AI summary
A curable silicone composition is provided that is exhibits excellent wetting properties on glass substrates and that forms a cured product that has a smooth surface. The curable silicone composition comprises: (A-1) a resinous alkenyl group-containing organopolysiloxane in which aryl groups account for more than 30 mol % of all silicon atom-bonded functional groups; (A-2) a linear alkenyl group-containing organopolysiloxane in which aryl groups account for more than 30 mol % of all silicon atom-bonded functional groups; (B) a linear organopolysiloxane or a cerium-containing organopolysiloxane, in which aryl groups account for no more than 30 mol % of all silicon atom-bonded functional groups, contained in an amount of no more than 2% by mass based on the total mass of all organopolysiloxane components; (C) an organohydrogenpolysiloxane including at least 2 silicon atom-bonded hydrogen atoms per molecule, that is different from component (B); and (D) a catalyst for hydrosilylation reaction.