Curable Granular Silicone Composition for Warpage Reduction
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Solution Overview
Problem
Existing curable silicone compositions face challenges with insufficient workability, curing characteristics, gap-filling properties, and flexibility at temperatures from room temperature to 150°C, leading to warpage and breakage issues, especially in thin-film molding of large areas and integrated molding with thin substrates.
Innovation Solution
A curable granular silicone composition comprising organopolysiloxane resin microparticles with curing reactive functional groups, functional inorganic fillers, and a curing agent, characterized by a storage elastic modulus of 2,000 MPa or less at 25°C and 100 MPa or less at 150°C, with a peak loss tangent of 0.40 or more, providing improved workability, curing characteristics, and stress relief.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a relatively large amount of functional filler is blended to improve mechanical properties and reduce cost, then the content of functional filler increases, but the stress relief properties decrease and warpage and breakage occur
Solution Approach 1:
The patent changes the particle size parameter of the functional filler, specifically using fine particles with an average particle diameter of 10 μm or less. This parameter change allows for increased filler content while maintaining stress relief properties, as the fine particles can be more uniformly distributed and do not create the same stress concentration issues as coarse particles.
Solution Approach 2:
The patent applies local quality by ensuring uniform distribution of fine functional filler particles throughout the silicone composition. This uniform local distribution prevents stress concentration points that would lead to warpage and breakage, while still achieving the desired high filler content for mechanical property improvement and cost reduction.
2Ease of manufacture
If existing curable silicone compositions are used for thin-film molding of large areas, then molding is performed, but warpage or breakage of the cured product occurs
Solution Approach 1:
The patent changes the particle size parameter of the filler to fine particles (average diameter ≤10 μm), which enables successful thin-film molding of large areas without warpage or breakage. The fine particles provide better flow characteristics during molding and create a more uniform cured product structure that resists warpage.
Solution Approach 2:
The patent creates a composite material system combining silicone resin with fine functional filler particles. This composite structure provides both the manufacturability needed for thin-film molding and the reliability to prevent warpage and breakage, as the fine filler particles reinforce the matrix without creating stress concentration points.
3Reliability
If liquid or paste curable silicone compositions are used, then curing is achieved, but workability, curing characteristics, and gap-filling properties are insufficient
Solution Approach 1:
The patent changes the physical state parameter of the composition from liquid or paste to a granular solid form containing fine particles. This parameter change improves workability and gap-filling properties while maintaining good curing characteristics, as the granular form allows for better handling and distribution during application.
4Strength
If coarse particle fillers are used to improve strength, then hardness increases, but flexibility and toughness decrease and material becomes difficult to apply
Solution Approach 1:
The patent changes the particle size parameter from coarse particles to fine particles with an average diameter of 10 μm or less. This parameter change maintains the strength and hardness benefits of filler reinforcement while preserving flexibility and toughness, as the fine particles create a more uniform structure without stress concentration points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves superior gap-filling properties and flexibility at elevated temperatures, reducing warpage and breakage, and can be efficiently manufactured using simple mixing processes, making it suitable for semiconductor devices and other applications.
Implementation Method 1
organopolysiloxane resin microparticles having a curing reactive functional group
Implementation Method 2
superior gap-filling properties while melted
Data Source
AI summary
Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G′/G″), is 0.40 or more.