Curable Silicone Composition for Die Bonding Adhesion
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Solution Overview
Problem
Existing curable silicone compositions for die bonding of optical semiconductor elements, such as LEDs, lack adequate adhesive strength, particularly in thin adhesive layers.
Innovation Solution
A curable silicone composition comprising organopolysiloxane with at least 2 alkenyl groups, platinum-group metal hydrosilylation reaction catalyst, hydrosilylation reaction inhibitor, adhesiveness-bestowing agent, and fumed silica, optimized to achieve specific vulcanization characteristics and mechanical properties for enhanced adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional curable silicone compositions are used for die bonding, then the adhesive layer can be applied, but the adhesive strength (die shear strength) is insufficient
Solution Approach 1:
The patent changes the chemical composition parameters of the silicone adhesive by incorporating specific ratios of crosslinking agents, fillers, and curing catalysts. This modifies the molecular structure and bonding characteristics of the adhesive layer, enabling it to achieve sufficient adhesive strength and bonding reliability even in thin film applications
Solution Approach 2:
The patent creates a composite silicone adhesive system by combining multiple components including organopolysiloxane base resin, crosslinking agents (such as silane compounds), inorganic fillers (such as colloidal silica), and curing catalysts. This composite formulation enhances both adhesive strength and bonding reliability while maintaining applicability to thin adhesive layers
2Length of stationary object
If the adhesive layer is made thin for die bonding, then the bonding area is optimized, but the adhesive strength becomes insufficient
Solution Approach 1:
The patent modifies the rheological and mechanical parameters of the silicone adhesive through controlled crosslinking density and filler content. This enables the adhesive to maintain adequate strength in thin film configurations (typically 1-10 micrometers) while still providing sufficient bonding capability for semiconductor die attachment
Solution Approach 2:
The patent optimizes the local properties of the adhesive layer by distributing crosslinking agents and fillers uniformly throughout the composition. This ensures that even in thin adhesive layers, the bonding interface receives adequate mechanical strength and adhesion promotion without requiring increased layer thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively adheres semiconductor chips to supports with improved adhesive strength, hardness, and flexibility, suitable for thin film die bonding applications.
Implementation Method 1
organopolysiloxane having at least 2 alkenyl groups per molecule, organopolysiloxane having, per molecule, at least 2 siloxane units represented by the formula RHSiO... platinum-group metal hydrosilylation reaction catalyst
Data Source
AI summary
A curable silicone composition for die bonding use contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.