Curable Silicone Composition with SiO4/2 for Heat-Stable Encapsulation
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Solution Overview
Problem
Existing curable silicone compositions used in semiconductor devices face issues with increased hardness and embrittlement when exposed to high temperatures, leading to reduced durability and reliability, and they also suffer from coloring problems that affect optical performance.
Innovation Solution
A curable silicone composition comprising an organopolysiloxane resin with 20 mol % or more SiO4/2 siloxane units and a mass loss of 2.0% or less at 200°C, combined with a liquid straight or branched chain organopolysiloxane and a curing agent, which maintains flexibility and prevents embrittlement even at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If phenyl silicone resin is used to achieve hot-melt properties and superior hardness, then the cured product has high strength, but coloring occurs at temperatures of 200°C or higher and light reflectance decreases
Solution Approach 1:
The patent extracts the problematic phenyl groups from the silicone resin structure and replaces them with methyl groups, creating a methyl silicone resin base that does not undergo thermal coloring. The desired hot-melt properties and strength are then achieved through controlled introduction of specific siloxane units (SiO4/2) and appropriate crosslinking density rather than through phenyl groups.
Solution Approach 2:
The patent changes the chemical composition parameters of the silicone resin by specifying that it contains 20 mol% or more of SiO4/2 siloxane units and has a mass loss of 2.0% or less at 200°C. These parameter specifications ensure the resin achieves hot-melt properties and high strength without the coloring issues of phenyl-containing resins.
2Object-affected harmful factors
If methyl silicone resin is used to avoid coloring, then color resistance is improved, but the cured product dramatically increases in hardness and becomes embrittled when exposed to temperatures of 150°C or higher
Solution Approach 1:
The patent creates a composite silicone resin system that combines methyl silicone resin with specific amounts of SiO4/2 siloxane units and crosslinking agents. This composite structure achieves both color resistance (inherent to methyl silicone) and high-temperature durability (achieved through controlled crosslinking and specific siloxane composition) simultaneously.
Solution Approach 2:
The patent introduces specific functional siloxane units (SiO4/2 with 20 mol% or more) into the methyl silicone resin structure at localized positions. These specific units provide the necessary crosslinking density and thermal stability without requiring phenyl groups, thereby maintaining color resistance while preventing embrittlement at high temperatures.
3Ease of operation
If the organopolysiloxane resin contains high SiO4/2 content to achieve hot-melt properties, then hot-meltability is improved, but the mass loss increases at high temperatures
Solution Approach 1:
The patent optimizes the SiO4/2 content parameter to be 20 mol% or more but not excessive, and simultaneously controls the mass loss parameter to be 2.0% or less at 200°C. This balanced parameter specification ensures sufficient hot-meltability for molding while preventing excessive mass loss that would indicate decomposition or volatile content.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a durable, flexible, and color-stable cured product suitable for semiconductor encapsulation, with improved thermal stability and optical properties, and can be easily molded into granules, pellets, or sheets for various applications.
Implementation Method 1
the mass loss rate of the organopolysiloxane resin when exposed to 200° C. for 1 hour is 2.0 mass % or less
Implementation Method 2
curable silicone composition comprising: an organopolysiloxane resin
Data Source
AI summary
Provided is a curable silicone composition and applications thereof. The curable silicone composition has hot-melt properties, excellent workability, and curing characteristics such as overmolding, and a cured product obtained therefrom does not become hard or brittle, even if left at a temperature of 150° C. or higher for a long time. The curable silicone composition comprises: an organopolysiloxane resin component which is non-hot-meltable, comprises a siloxane unit represented by SiO4/2 making up at least 20 mol % or more of the total siloxane units, and has a mass loss of 2.0 mass % or less when exposed to 200° C. for 1 hour; a liquid straight-chain or branched chain organopolysiloxane; and a curing agent.