Low-Temperature Curable Silicone Composition for Semiconductor Encapsulation
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Solution Overview
Problem
Conventional thermosetting silicone compositions require high temperatures for curing, leading to shape shrinkage and potential damage to semiconductor elements, while low-temperature curing products often have low transparency and adhesiveness, compromising long-term reliability.
Innovation Solution
A curable silicone composition comprising a resinous alkenyl group-containing organopolysiloxane, a resinous organohydrogenpolysiloxane, a platinum-based catalyst for hydrosilylation reaction, and a curing reaction inhibitor, which allows for efficient curing at low temperatures with low shape deformation and shrinkage, and produces a transparent cured product with high hardness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high temperature curing is used for thermosetting silicone compositions, then curability is improved, but shape shrinkage and damage to semiconductor elements occur
Solution Approach 1:
The invention changes the curing temperature parameter from high temperature to low temperature range, enabling effective curing without causing shape shrinkage or damage to semiconductor elements. This is achieved through the specific composition ratio of orthosiloxane units and the selection of appropriate catalysts.
Solution Approach 2:
The invention uses a composite silicone composition containing multiple components including orthosiloxane units, crosslinking agents, and catalysts in specific ratios. This composite approach enables low-temperature curing while maintaining curability and preventing shape deformation.
2Shape
If low temperature curing is used, then shape deformation is reduced, but transparency and adhesiveness deteriorate
Solution Approach 1:
The invention optimizes the ratio of orthosiloxane units to crosslinking agents and adjusts catalyst types and amounts to enable low-temperature curing that maintains both shape stability and optical properties. The specific parameter range of orthosiloxane content is critical for achieving transparency.
Solution Approach 2:
The invention introduces orthosiloxane units with specific local structural characteristics that enhance transparency and adhesiveness in the cured product. These units create local regions with desirable optical properties without compromising overall shape stability.
3Shape
If low temperature curing is used, then shape deformation is reduced, but curing effectiveness deteriorates
Solution Approach 1:
The invention uses catalysts as intermediaries to enable low-temperature curing. The catalysts facilitate the crosslinking reaction at lower temperatures, maintaining curing effectiveness without causing shape deformation. The selection and amount of catalyst are critical parameters.
Solution Approach 2:
The invention changes the curing temperature parameter to low temperature range while compensating for reduced reaction kinetics through optimized composition ratios and catalyst selection, thereby maintaining curing effectiveness without shape deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves effective curability at low temperatures with minimal shape deformation and shrinkage, and produces a transparent, hard cured product, enhancing the reliability and transparency of semiconductor packages.
Implementation Method 1
a platinum-based catalyst for hydrosilylation reaction
Data Source
AI summary
A curable silicone composition comprises (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (SiO4/2) unit, (B) a resinous organohydrogenpolysiloxane including at least two silicon atom-bonded hydrogen atoms per molecule and at least one (SiO4/2) unit, (C) a catalyst for hydrosilylation reaction, and (D) a curing reaction inhibitor. The curable silicone composition exhibits practically effective curability even at low temperatures, has a low shape deformation and shrinkage rate during curing, can be cured in a short period of time, and can form a transparent and high-hardness cured product.