Curable Silicone Composition for Optical Semiconductor Sealing
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Solution Overview
Problem
Curable silicone compositions used in optical semiconductor devices exhibit poor adhesive properties and reduced transparency over time under high temperature and high humidity conditions, leading to reliability issues in optical semiconductor devices.
Innovation Solution
A curable silicone composition comprising a mixture of organopolysiloxanes with specific molecular structures, including alkenyl groups, silicon-bonded hydrogen atoms, diorganodialkoxysilanes, and a catalytic amount of hydrosilylation catalyst, which forms a cured product with excellent initial adhesive properties and retention of transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesion-imparting agents (acryloxy functional alkoxysilane, methacryloxy functional alkoxysilane, or silane coupling agents) are added to curable silicone compositions to improve adhesive properties, then adhesive strength is improved, but the cured product exhibits reduced transparency and adhesive durability over time under high temperature and high humidity conditions
Solution Approach 1:
The patent changes the chemical parameters of the silicone composition by specifying precise compositional ratios: organopolysiloxane (A) with alkenyl groups at 100 mass%, branched chain organopolysiloxane (B) at 5-50 mass%, and diorganodialkoxysilane (C) at 0.1-10 mass%. This parameter optimization achieves both adhesion and durability without requiring traditional adhesion promoters that cause transparency degradation
Solution Approach 2:
The patent creates a composite curable silicone composition combining three distinct components with specific functions: organopolysiloxane (A) provides base polymer structure and adhesion, branched chain organopolysiloxane (B) enhances mechanical properties and stability, and diorganodialkoxysilane (C) contributes to crosslinking and durability. This composite formulation achieves superior adhesive durability and transparency retention under high temperature and high humidity conditions compared to conventional single-component or additive-based formulations
2Ease of manufacture
If conventional curable silicone compositions are used to seal or bond optical semiconductor elements, then device assembly is achieved, but the device reliability significantly reduces under conditions of high temperature and high humidity
Solution Approach 1:
The patent optimizes the compositional parameters of the curable silicone composition to achieve both ease of manufacture and high reliability. The specific formulation with organopolysiloxane (A) at 100 mass%, branched chain organopolysiloxane (B) at 5-50 mass%, and diorganodialkoxysilane (C) at 0.1-10 mass% provides excellent adhesion, transparency, and durability, enabling reliable optical semiconductor device assembly and operation under harsh conditions
Solution Approach 2:
The patent employs a composite curable silicone composition that combines multiple functional components to simultaneously achieve ease of manufacture and high reliability. The synergistic combination of organopolysiloxane (A), branched chain organopolysiloxane (B), and diorganodialkoxysilane (C) creates a sealing or bonding material that maintains adhesive strength and transparency under high temperature and high humidity, ensuring optimal optical semiconductor device reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cured product demonstrates excellent adhesive durability and retention of transparency under high temperature and high humidity, significantly improving the reliability of optical semiconductor devices when used as a sealing agent or adhesive.
Implementation Method 1
Hydrosilylation reaction curable silicone compositions form cured products having excellent properties such as weathering resistance and heat resistance
Data Source
Figure 1
AI summary
A curable silicone composition comprising: (A) (A1) an organopolysiloxane having at least two alkenyl groups in a molecule and free of silicon-bonded hydroxyl groups or silicon-bonded hydrogen atoms, or a mixture of said component (A1) and (A2) a branched chain organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a diorganodialkoxysilane represented by a general formula; (D) a straight chain organosiloxane oligomer having at least one silicon-bonded hydroxyl group in a molecule and free of silicon-bonded hydrogen atoms; and (E) a hydrosilylation catalyst, can form a cured product which exhibits excellent initial adhesive properties and transparency and exhibits excellent adhesive durability and retention of transparency under conditions of high temperature and high humidity.