Curable Siloxane Composition for Flexible Electronic Packaging
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Solution Overview
Problem
Conventional flexible packaging materials for soft electronic devices, such as thermoplastic polyurethane and polydimethylsiloxane, face issues with thermal tolerance, recoverability, and adhesion, necessitating a novel material with enhanced stretchability, recoverability, and interface adhesion.
Innovation Solution
A curable composition comprising a terminal siloxane epoxy resin, a side-chain siloxane epoxy resin, a cage siloxane epoxy resin, and a terminal siloxane anhydride, with specific molecular weights and molar ratios, which forms a cured product with improved mechanical strength, stretchability, recoverability, and interface adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If thermoplastic polyurethane is used as flexible packaging material, then flexibility and stretchability are improved, but thermal tolerance and recoverability deteriorate
Solution Approach 1:
The patent uses a composite material system combining siloxane epoxy resin with specific curing agents to create a flexible packaging material that simultaneously achieves good flexibility and thermal tolerance. The siloxane-based composition maintains shape stability at elevated temperatures while preserving the flexibility needed for soft electronic device packaging.
2Shape
If polydimethylsiloxane is used as flexible packaging material, then flexibility and thermal tolerance are improved, but adhesion and gas barrier property deteriorate
Solution Approach 1:
The patent modifies the chemical composition parameters by incorporating specific curing agents (carboxylic acid group-containing compounds, phenolic group-containing compounds, or amine group-containing compounds) into the siloxane epoxy resin system. This parameter change enhances the adhesion properties and gas barrier performance while maintaining the flexibility and thermal tolerance inherent to siloxane-based materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a flexible packaging material that effectively protects soft electronic devices by enhancing stretchability, recoverability, and interface adhesion while maintaining mechanical strength and thermal tolerance.
Implementation Method 1
the curable composition includes 100 parts by mole of the first siloxane compound, 1 to 15 parts by mole of the second siloxane compound, 1 to 15 parts by mole of the third siloxane compound, and 90 to 250 parts by mole of curing agent
Data Source
AI summary
A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I)wherein n is 8 to 232, wherein R1 is independently C1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II)wherein x≥2, y≥2, and x/y is between 0.1 and 3, and R2, R3 and R4 are independently C1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III)and 90 to 250 parts by mole of a curing agent represented by Formula (IV)wherein m is 7 to 230, wherein R5 is independently C1-3 alkyl group.